Plating of articles

ABSTRACT

The present invention relates to the field of plating, including, but not limited to electroplating metallic articles, for example metallic discs that can be used as, or converted into, coins. Embodiments of the present invention described herein incorporate luminescent particles into plated metallic layers so that they can be detected for security purposes.

TECHNICAL FIELD

The present invention relates to the field of plating, including, butnot limited to electroplating metallic articles, for example metallicdiscs that can be used as, or converted into, coins. Embodiments of thepresent invention described herein incorporate luminescent particlesinto plated metallic layers so that they can be detected for securitypurposes.

BACKGROUND

The counterfeiting of coins (e.g., monetary currency and tokens) andother metal objects is an ongoing problem. (Coins may also be referredto herein as “coinage.”) Many measures have been put into place toincrease the difficulty with which coins can be counterfeited. Thisincludes complex three-dimensional patterning on surfaces of the coins.

Other types of currency, such as bank notes, often include certainsecurity features. These security features may include metallic strips,watermarks, holograms, fluorescent markers, optically variable inks,complex printed patterns, and embossing. However, it is more difficult,or impractical, to include similar security features in coins.

Coins are typically produced by mechanically stamping (also referred toas striking) a metal disc (or blank), to form a three-dimensionalpattern on the disc, which provides the coin with its identity anddenotes its value. Some recent methods of producing coins involveproviding a coin blank, typically of a less expensive metal, and plating(e.g., electroplating or electroless plating) metals of higher valueonto the coin blank. The plated coin blank can then be struck to formthe final coin. For any security feature to be incorporated into such acoin, it should not affect the patterning of the coin, including thequality of its finish (of its plated surface), nor its structuralintegrity. The incorporation of a security feature into a coin shouldalso be reasonably economical to avoid increasing the cost of coinproduction to unacceptable levels. The functioning of any securityfeature should also ideally last and remain sufficiently constant forthe entire duration that a coin is in commercial (e.g., public)circulation, which in many cases is a number of years.

SUMMARY

In a first aspect, there is provided a method for plating articles, themethod comprising providing a plating solution comprising a liquidmedium, a precursor species suitable for forming a metallic layer on thearticles, and a plurality of luminescent particles suspended in theliquid medium, at least some of which have a diameter of 10 μm or less;and plating the articles within the plating solution, such that theprecursor species forms the metallic layer on the articles and theluminescent particles are deposited within the metallic layer while itis formed.

Optionally, before and/or during the plating of the articles, theplating solution is subjected to an ultrasound (also referred to as“ultrasonic” herein) treatment.

In a second aspect, there is provided a method for plating articles, themethod comprising providing a plating solution comprising a liquidmedium, a precursor species suitable for forming a metallic layer on thearticles, and a plurality of luminescent particles suspended in theliquid medium; and plating the articles within the plating solution,such that the precursor species forms the metallic layer on the articlesand the luminescent particles are deposited within the metallic layerwhile it is formed, wherein, before and/or during the plating of thearticles, the plating solution is subjected to an ultrasound treatment.

In a third aspect, there is provided a method of making a patternedarticle, wherein the method comprises carrying out a method for platingarticles according to the first or second aspects, and, after producingthe plurality of plated articles, stamping a pattern onto at least onesurface of each of the articles.

In a fourth aspect, there is provided a plating solution comprising aliquid medium, a precursor species for forming a metallic layer during aplating process, and a plurality of luminescent particles suspended inthe liquid medium, at least some of which have a diameter of 10 μm orless.

In a fifth aspect, there is provided an article producible in accordancewith the method of the first, second, and/or third aspect.

In a sixth aspect, there is provided an article having an electroplatedmetallic layer thereon, wherein luminescent particles are homogenouslydispersed in the electroplated metallic layer, at least some of theluminescent particles having a diameter of 10 μm or less.

In a seventh aspect, there is provided an article having anelectroplated metallic layer thereon, wherein luminescent particles aredispersed in the electroplated metallic layer in a first portion of theelectroplated metallic layer, and a second portion of the electroplatedmetallic layer substantially absent of luminescent particles is disposedbetween the first portion and the article, wherein a depth of the secondportion is less than 4 μm.

In an eighth aspect, there is provided an apparatus, which may be forcarrying out the method of any of the aspects described herein.

Embodiments of the present invention incorporate luminescent particles(also referred to herein as “taggant particles” or simply “taggants” or“markers”) within a plated (e.g., electro- or electroless plating) layeron an article to provide a security feature. In some embodiments, anelectroplated layer is produced in which there is a homogenousdistribution of the particles and a strong electromagnetic signalobtained from the luminescent particles. In some embodiments, theelectroplated articles are stamped (e.g., mechanically) with a pattern,with no adverse effect on the quality of the pattern and its finishcompared to an equivalent electroplated article that omits theluminescent particles from its plated layer. When plating with asolution in embodiments as described herein, before the luminescentparticles are deposited, a layer of metal may first be laid down (i.e.,plated) that is essentially free of luminescent particles. However,using techniques described herein, the depth of this particle-free layercan be reduced. Embodiments described herein are applicable to theproduction of coins or coin blanks (also referred to as “coinage”).

The description of this specification includes the subject matters ofeach of the claims and of the claim combinations allowed by dependency.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 shows schematically an example of an apparatus for carrying outembodiments of plating processes described herein.

FIG. 2 shows a variance of luminescent signal strength with the sizes ofluminescent particles.

FIG. 3 shows a scanning electron micrograph (“SEM”) image of across-section of an article plated in accordance with embodiments of thepresent invention.

FIG. 4 shows a scanning electron micrograph of a surface of anelectroplated and patterned article in which having luminescentparticles having a diameter of approximately 5 μm or larger aredispersed in the electroplated layer.

FIGS. 5-8 show digital images of electroplated and struck coins ofvarying quality of finish standards.

FIG. 9 shows a scanning electron micrograph image of a cross-section ofan exemplary electroplated article exhibiting a homogenous, or uniform,distribution of luminescent particles incorporated into the platedlayer.

FIG. 10 shows a scanning electron micrograph image of a cross-section ofan exemplary electroplated article exhibiting a non-homogenous, ornon-uniform, distribution of luminescent particles incorporated into theplated layer.

FIG. 11 shows a flow diagram of steps configured in accordance withembodiments of the present invention.

FIG. 12 shows schematically an example of an apparatus for carrying outembodiments of plating processes described herein, as described inExample 2 below.

FIG. 13 shows some results from Example 2 below, in particular acomparison of percentage incorporation of luminescent particles under aprocess that involved use of a high shear pump using the apparatus ofFIG. 12, and a process that did not use a high shear pump.

DETAILED DESCRIPTION

It will be readily understood that the components of the presentinvention, as generally described and illustrated in the figures herein,may be arranged and designed in a wide variety of differentconfigurations. Thus, the descriptions of the embodiments of the presentinvention, as represented in the figures, is not intended to limit thescope of the invention as claimed, but is merely representative ofselected embodiments of the invention.

The features, structures, or characteristics of the invention describedthroughout this specification may be combined in any suitable manner inone or more embodiments. For example, the usage of the phrases“examples,” “example embodiments,” “some embodiments,” “embodiments,” orother similar language, throughout this specification refers to the factthat a particular feature, structure, or characteristic described inconnection with the embodiment may be included in at least oneembodiment of the present invention. Thus, appearances of the phrases“in embodiments,” “example embodiments,” “in some embodiments,” “inother embodiments,” or other similar language, throughout thisspecification do not necessarily all refer to the same group ofembodiments, and the described features, structures, or characteristicsmay be combined in any suitable manner in one or more embodiments.

Embodiments of the present invention provide the previously mentionedaspects, including optional and preferred features of the variousaspects as further described below. Unless otherwise stated, anyoptional or preferred feature may be combined with any other optional orpreferred feature, and with any of the aspects of the inventionmentioned herein.

Herein, “suspension,” “colloidal suspension,” “stable suspension,” orany similar terminology generally refers to a mixture of two or morematerials where at least one is dispersed in the other at a microscopiclevel, but not chemically bonded to it. The particles that act as thecolloid in a suspension tend to be evenly distributed throughout thesuspension if it has been recently mixed or stirred, but will settle tothe bottom of the solution (also referred to herein as “sedimentation”)due to gravity if it is allowed to sit undisturbed for an extendedperiod of time.

Herein, “electroplating,” “plating,” “plating process,” or any similarterminology refers to formation of a metallic layer on a substrate.

Plating methods described herein may involve the reduction of aprecursor species comprising metal ions in the carrier medium, such thatthe metal ions form a metallic layer. A method utilized may be anelectroplating method in which an electrical potential is applied to aplurality of articles, such that precursor species form a metalliclayer. In embodiments, the method may involve electroless plating,wherein the precursor comprises metal ions, and the carrier mediumfurther comprises a reducing agent, capable of chemically reducing themetal ions, such that they form a metallic layer.

The articles (before being plated) may be of any shape or size. Inembodiments, the articles may be in the form of discs. The discs may becircular or of some other regular shape. The regular shape may, forexample, be a shape having n sides, where n is 3 or more, and optionallyn is selected from 3 to 15, optionally from 3 to 10, optionally from 3to 12. If the articles have regular shapes, the sides of the shapes maybe straight or curved. The discs may be apertured or non-apertured. Insome embodiments, the disc may comprise an aperture, which may belocated in a central portion of the face of the disc, and optionallyextend the entire way through the disc. Optionally, the aperture may,for example, be for receiving a further smaller disc in the productionof a bimetallic coin. The discs may have a thickness that issubstantially the same across their entire face (or cross-section).

In an embodiment, the articles (before being plated) may be spherical orsubstantially, spherical, and may, before and/or after being plated, maybe suitable for use as ball bearings.

In an embodiment, the articles, before and/or after being plated, aresuitable for use as a component of a mechanical or electrical item,including, but not limited to any moving parts, any structural parts,electrically conductive parts, and/or any housing of the mechanical orelectrical item. Mechanical or electrical items include, but are notlimited to, watches, vehicles and aircraft.

The articles (before being plated) may comprise, consist essentially of,or consist of one or more first metal(s). The one or more first metal(s)may be in elemental form or in the form of an alloy. In an embodimentthe one or more first metal(s) comprise a metal selected from Groups 3to 14 of the Period Table, optionally from Groups 3 to 12 of thePeriodic Table, and wherein the metal is in alloy or elemental form. Inan embodiment, the first metal comprises a metal selected from iron,aluminium, copper, titanium, zinc, silver, gold, platinum, and whereinthe metal is in alloy or elemental form. In embodiments, the one or morefirst metal(s) comprise iron. In embodiments, the one or more firstmetal(s) comprise steel. If the articles consist essentially of thefirst metal(s), the metal(s) may constitute at least 95 wt %(weight-weight percentage) of the article, optionally at least 98 wt %of the article, optionally at least 99 wt % of the article, optionallyat least 99.5 wt % of the article.

The articles (before being plated) may comprise a core, which maycomprise a metal or a non-metal, having one or more layers thereon, andthe one or more layers may comprise a metal(s) different to that of thecore and/or other layers.

In an embodiment, the articles before being plated in accordance withthe method described herein, comprises a non-metal, and the non-metalmay be plated using the method described herein using electrolessplating, such that the metallic layer is formed on the non-metal and theluminescent particles are deposited within the metallic layer while itis formed. The non-metal may be selected from a plastic, a glass and aceramic material.

In an embodiment, the articles, before being plated in accordance withthe method described herein, comprise a non-metal, and the non-metal maybe coated with, e.g. plated using electroless plating to form, a firstlayer of metal on the non-metal (the first layer of metal lacking theluminescent particles), and the articles then plated in accordance withthe method described herein, e.g. using electroplating or electrolessplating, to form a second layer of metal on the first layer of metal,the second layer of metal being the metallic layer in which theluminescent particles are deposited within while the metallic layer isformed.

In embodiments, the articles (before being plated) may be in the form ofdiscs and comprise, consist essentially of, or consist of a first metal.The discs may have a diameter, as measured across a face of the disc, offrom 0.5 cm to 10 cm, optionally from 0.5 cm to 5 cm, optionally from0.5 cm to 3 cm. If the disc has a regular shape, the diameter may be thelargest dimension across a face of the disc. The disc may have athickness of from 0.3 mm to 10 mm, optionally from 0.3 mm to 5 mm,optionally from 0.3 mm to 2 mm.

The metallic layer that is plated (also referred to as the plated metalmatrix) comprises a metal, which may be termed a second metal herein.The second metal may be selected from a transition metal. The secondmetal may be selected from zinc, copper, tin, nickel, and alloys of oneor more thereof, including, but not limited to, brass. The metalcomponents of the alloys may comprise, consist essentially of or consistof at least two of zinc, copper and nickel or alloys may comprise,consist essentially of or consist of at least two of zinc, copper,nickel and tin. The precursor species may comprise ions of the secondmetal, and one or more appropriate anions. Where the second metalcomprises an alloy of two or more metals, the precursor may compriseions of the different types of metal constituting the alloy. Forexample, where the second metal is brass, the precursor may compriseions of copper and zinc, and optionally one or more other metals such astin. In embodiments, the articles may comprise, consist essentially of,or consist of steel, and the metallic layer comprises a metal selectedfrom zinc, copper, tin, nickel, and an alloy of one or more thereof. Themetal components of the alloys may comprise, consist essentially of orconsist of at least two of zinc, copper and nickel or alloys maycomprise, consist essentially of or consist of at least two of zinc,copper, nickel and tin. The precursor material may comprise metal ionsof the metal to be deposited in the metallic layer. The plating solutionmay comprise from 5 g/L to 150 g/L of metal ions that will form themetallic layer. The plating solution may comprise from 5 g/L to 150 g/Lof metal ions, wherein the metal is selected from zinc, copper, tin, andnickel, and combinations thereof.

In embodiments, the plating solution may comprise from 5 g/L to 50 g/Lof zinc ions, optionally from 10 g/L to 30 g/L of zinc ions, optionallyfrom 15 g/L to 25 g/L of zinc ions, optionally from 16 g/L to 22 g/L ofzinc ions. The precursor ions, that is the metal ions that will form themetallic layer, may be zinc ions or may be a mixture of zinc ions andone or more other metal ions, e.g. selected from copper ions, nickelions and optionally tin ions, and a combination thereof. Where theprecursor ions are zinc ions in combination with one or more other metalions, the plating solution may comprise in total from 5 g/L to 150 g/Lof metal ions that will form the metallic layer.

In embodiments, the plating solution may comprise from 10 g/L to 150 g/Lof copper ions, optionally from 20 g/L to 120 g/L of copper ions,optionally from 20 g/L to 100 g/L of copper ions, optionally from 30 g/Lto 90 g/L of copper ions. The precursor ions, that is the metal ionsthat will form the metallic layer, may be copper ions or may be amixture of copper ions and one or more other metal ions, e.g. selectedfrom zinc ions, nickel ions and optionally tin ions, and a combinationthereof. Where the precursor ions are copper ions in combination withone or more other metal ions, the plating solution may comprise in totalfrom 5 g/L to 150 g/L of metal ions that will form the metallic layer.

In embodiments, the plating solution may comprise from 10 g/L to 150 g/Lof nickel ions, optionally from 30 g/L to 130 g/L of nickel ions,optionally from 40 to 120 g/L of nickel ions. The precursor ions, thatis the metal ions that will form the metallic layer, may be nickel ionsor may be a mixture of nickel ions and one or more other metal ions,e.g. selected from zinc ions, copper ions and optionally tin ions, and acombination thereof. Where the precursor ions are nickel ions incombination with one or more other metal ions, the plating solution maycomprise in total from 5 g/L to 150 g/L of metal ions that will form themetallic layer.

The metallic layer, after plating onto the article(s), may have athickness of at least 5 μm, optionally at least 10 μm, optionally atleast 15 μm, optionally at least 20 μm, optionally at least 25 μm. Themetallic layer may have a thickness of from 5 μm to 50 μm, optionallyfrom 10 μm to 40 μm, optionally from 15 μm to 35 μm, optionally from 15μm to 35 μm, optionally from 15 μm to 30 μm, optionally from 20 to 30μm. The depth of the metallic plating may be measured using any suitabletechnique, including, but not limited to x-ray fluorescence (“XRF”) andscanning electron microscopy (“SEM”).

The plating may be carried out while the articles are within areceptacle that is placed within the container of plating solution. Inembodiments, the receptacle moves within the plating solution. Thereceptacle may act to tumble the articles within the receptacle duringthe plating. In embodiments, the receptacle rotates within the platingsolution. Such a receptacle may be in the form of a barrel. This may betermed barrel plating. The articles may be free to move within thereceptacle (e.g., barrel) such that when the receptacle rotates, thearticles move (e.g., rotate and/or tumble) within the receptaclerelative to one another. This has been found to provide a relativelyconsistent plate thickness on all sides of the articles.

In embodiments of the present invention, the plating is carried outwhile the articles are within a receptacle that moves continuouslyduring the plating process. The plating may be carried out while thearticles are within a receptacle that rotates continuously during theplating process. The receptacle may rotate on an axis that issubstantially horizontal. The receptacle may move (e.g., rotate) at aconstant rate during the plating. Optionally, the articles arecontinuously rotated in a barrel, and optionally at a constant rate,during the plating of the plurality of articles. Optionally, therotation of the barrel is periodically interrupted. The receptacle(e.g., barrel) may rotate at a speed of 1 to 50 rpm, optionally from 4to 30 rpm, optionally from 4 to 15 rpm, optionally from 4 to 12 rpm,optionally from 6 to 10 rpm, optionally about 8 rpm. The rate ofrotation may be varied during plating or be held constant, for examplefor the entire duration of the plating.

In some embodiments, an electrical potential is applied to the articles,such that they form a cathode within the plating solution, and a furtherelectrode is present within the plating solution that forms an anode.The anode may be in any suitable form. In some embodiments, the anodecomprises a metallic mesh material, which may form a basket. If thearticles are within a receptacle as described above, the receptacle maycomprise or be formed out of a non-conducting material, such as plastic,and an electrode may extend into the receptacle, this electrode actingas a cathode during plating. The electrode acting as a cathode maycontact at least some of the articles within the receptacle duringplating.

Luminescent, or fluorescent, materials or particles (fluorescentparticles are a subset of luminescent particles) described herein mayabsorb light at a first wavelength and then emit light at a secondwavelength, which may be shorter (“anti-Stokes emission”) or longer(“Stokes emission”) than the first wavelength, or substantially the sameas the first wavelength. The luminescent particles may absorb light inthe infrared (“IR”), visible, or ultraviolet (“UV”) range, for examplein the range of 200 nm to 5 μm of the electromagnetic spectrum.

Luminescent particles may be or comprise a phosphor material. Phosphorsmaterials are typically comprised of a host, typically comprised of acrystalline lattice, doped with luminescence centers comprised of traceamount of dopants, usually comprised of a transition metal, lanthanides,or actinides. A description of the design, synthesis, and opticalcharacteristics of phosphors is provided in Chapter 6 of “Luminescenceand the Solid State” by R. C. Ropp, second edition, which is herebyincorporated by reference herein.

In embodiments, the luminescent materials may comprise an inorganicphosphor, for example a phosphor selected from an yttrium aluminumgarnet (“YAG”) phosphor. The YAG phosphor may comprise yttrium aluminumgarnet doped with a metal, for example a metal selected from atransition metal, a lanthanide, and an actinide. The YAG phosphor maycomprise yttrium aluminum garnet doped with a metal selected from Ce,Nd, Tb, Sm, Dy, and Cr(IV).

In embodiments of the present invention, at least some of theluminescent particles have a diameter of 10 μm or less, optionally 5 μmor less, optionally 3 μm or less, optionally 2 μm or less. Inembodiments, at least some of the luminescent particles have a diameterof from 0.5 μm to 1 μm, optionally from 0.6 μm to 1 μm, optionally from0.7 μm to 0.9 μm, optionally about 0.8 μm. As further described in theExamples herein, particle size can have an effect on, amongst otherfactors, the luminescent signal emitted from the luminescent particlesonce incorporated in the plated layer. As shown in FIG. 2, luminescentparticles having diameters of from approximately 0.5 μm to 1 μm werefound to have the strongest (highest) luminescent signals, and did notappear to affect the surface quality (e.g., quality of finish of thesurface) of the articles even after they had been struck into coins.They also allowed for a relatively stable suspension of the luminescentparticles when in the plating solution.

The diameter (and correspondingly, determinations of the mean diameters)of a luminescent particle and/or any particle size distributionmeasurements may be measured using any suitable technique, including,but not limited to, scanning electron micrograph (“SEM”), and/or laserlight scattering, for example in accordance with ASTM UOP856-07. Thediameter of a luminescent particle may be the largest dimension measuredacross the particle. ASTM UOP856-07 is a well-known standardized methodfor determining the particle size distribution of powders and slurriesusing laser light scattering. This standard is commercially availablefrom ASTM International. The laser light scattering measurements inaccordance with this standard may be performed with a Microtrac ModelS3500 instrument commercially available from Microtrac Inc., or aMalvern Instruments Mastersizer 3000. In embodiments, the luminescentparticles may be characterised as described in ASTM F1877-05 (2010). Theparticle size distribution measured in accordance with ASTM UOP856-07,e.g. for D50, D90 and D99, may be defined as the volume particle sizedistribution. The mean particle size, measured in accordance with ASTMUOP856-07, may be defined as the volumetric mean particle size.

Luminescent particles utilized in plating processes described herein mayhave a mean diameter of 10 μm or less, optionally 5 μm or less,optionally 3 μm or less, optionally 2 μm or less. In embodiments, theluminescent particles may have a mean diameter of from 0.5 μm to 5 μm,e.g. 0.5 μm to 1 μm, optionally from 0.6 μm to 1 μm, optionally from 0.7μm to 0.9 μm, optionally about 0.8 μm. The mean diameter of theparticles may be measured before the particles are incorporated into theplating solution.

Luminescent particles utilized in plating processes described herein mayhave a D50 distribution of 10 μm or less, optionally 5 μm or less,optionally 3 μm or less, optionally 2 μm or less. A D50 distribution isdefined as 50% of the population of particles having sizes less than theD50 value, and 50% of the population of particles having sizes greaterthan the D50 value. In embodiments, the luminescent particles have a D50distribution of from 0.5 μm to 1 μm, optionally from 0.6 μm to 1 μm,optionally from 0.7 μm to 0.9 μm, optionally about 0.8 μm. The D50distribution of the particles may be measured before the particles areincorporated into the plating solution. D50 is sometimes termed d₅₀ inthe art.

Luminescent particles utilized in plating processes described herein mayhave a D90 distribution of 10 μm or less, optionally 5 μm or less,optionally 3 μm or less, optionally 2 μm or less, optionally 1 μm orless. A D90 distribution is defined as 90% of the population ofparticles having sizes less than the D90 value, and 10% of thepopulation of particles having sizes greater than the D90 value. Theluminescent particles may have a D90 distribution of from 0.5 μm to 5μm, optionally from 1 μm to 4 μm, optionally from 1 μm to 3 μm. The D90distribution of the particles may be measured before the particles areincorporated into the plating solution. D90 is sometimes termed d₉₀ inthe art.

In embodiments, luminescent particles, for example in the platingsolution and/or in the articles described herein, lack or substantiallylack particles having a diameter of 10 μm or more, optionally 8 μm ormore, optionally 7 μm or more, optionally 5 μm or more, optionally 4 μmor more, optionally 3 μm or more. “Substantially lack” may indicate 5 wt% of the particles or less, optionally 2 wt % or less, optionally 1 wt %or less have the stated diameter. Optionally, the particles may have aD99 distribution of 10 μm or less, optionally 8 μm or less, optionally 7μm or less, optionally 5 μm or more, optionally 4 μm or less, optionally3 μm or less. A D99 distribution is defined as 99% of the population ofparticles having sizes less than the D99 value, and 1% of the populationof particles having sizes greater than the D99 value. Optionally, theparticles may have a D99 of from 10 μm to 3 μm, optionally from 7 μm to3 μm, optionally from 5 μm to 3 μm.

In embodiments, luminescent particles may have a density of at least 2kg/dm³, optionally at least 3 kg/dm³, optionally at least 4 kg/dm³,optionally at least 5 kg/dm³. In embodiments, luminescent particles mayhave a density of from least 2 kg/dm³ to 9 kg/dm³, optionally from 3kg/dm³ to 9 kg/dm³, optionally from 4 kg/dm³ to 9 kg/dm³, optionallyfrom 5 kg/dm³ to 9 kg/dm³.

The luminescent particles may have a combination of size and density aslisted in any of Tables A, B and C below. The diameter, D50 distributionand D90 distribution referred to in Tables A-C may be measured asdescribed previously herein. In particular, the diameter, D50distribution and D90 distribution are measured using laser lightscattering, for example in accordance with ASTM UOP856-07.

TABLE A Feature Mean Diameter Density A 5 μm or less at least 2 kg/dm³ B5 μm or less at least 3 kg/dm³ C 5 μm or less at least 4 kg/dm³ D 5 μmor less at least 5 kg/dm³ E 5 μm or less 2 kg/dm³ to 9 kg/dm³ F 5 μm orless 3 kg/dm³ to 9 kg/dm³ G 5 μm or less 4 kg/dm³ to 9 kg/dm³ H 5 μm orless 5 kg/dm³ to 9 kg/dm I 3 μm or less at least 2 kg/dm³ J 3 μm or lessat least 3 kg/dm³ K 3 μm or less at least 4 kg/dm³ L 3 μm or less atleast 5 kg/dm³ M 3 μm or less 2 kg/dm³ to 9 kg/dm³ N 3 μm or less 3kg/dm³ to 9 kg/dm³ O 3 μm or less 4 kg/dm³ to 9 kg/dm³ P 3 μm or less 5kg/dm³ to 9 kg/dm Q 0.5 μm to 1 μm at least 2 kg/dm³ R 0.5 μm to 1 μm atleast 3 kg/dm³ S 0.5 μm to 1 μm at least 4 kg/dm³ T 0.5 μm to 1 μm atleast 5 kg/dm³ U 0.5 μm to 1 μm 2 kg/dm³ to 9 kg/dm³ V 0.5 μm to 1 μm 3kg/dm³ to 9 kg/dm³ W 0.5 μm to 1 μm 4 kg/dm³ to 9 kg/dm³ X 0.5 μm to 1μm 5 kg/dm³ to 9 kg/dm Y 0.7 μm to 0.9 μm at least 2 kg/dm³ Z 0.7 μm to0.9 μm at least 3 kg/dm³ AA 0.7 μm to 0.9 μm at least 4 kg/dm³ AB 0.7 μmto 0.9 μm at least 5 kg/dm³ AC 0.7 μm to 0.9 μm 2 kg/dm³ to 9 kg/dm³ AD0.7 μm to 0.9 μm 3 kg/dm³ to 9 kg/dm³ AE 0.7 μm to 0.9 μm 4 kg/dm³ to 9kg/dm³ AF 0.7 μm to 0.9 μm 5 kg/dm³ to 9 kg/dm

TABLE B Feature D50 distribution Density BA 5 μm or less at least 2kg/dm³ BB 5 μm or less at least 3 kg/dm³ BC 5 μm or less at least 4kg/dm³ BD 5 μm or less at least 5 kg/dm³ BE 5 μm or less 2 kg/dm³ to 9kg/dm³ BF 5 μm or less 3 kg/dm³ to 9 kg/dm³ BG 5 μm or less 4 kg/dm³ to9 kg/dm³ BH 5 μm or less 5 kg/dm³ to 9 kg/dm BI 3 μm or less at least 2kg/dm³ BJ 3 μm or less at least 3 kg/dm³ BK 3 μm or less at least 4kg/dm³ BL 3 μm or less at least 5 kg/dm³ BM 3 μm or less 2 kg/dm³ to 9kg/dm³ BN 3 μm or less 3 kg/dm³ to 9 kg/dm³ BO 3 μm or less 4 kg/dm³ to9 kg/dm³ BP 3 μm or less 5 kg/dm³ to 9 kg/dm BQ 0.5 μm to 1 μm at least2 kg/dm³ BR 0.5 μm to 1 μm at least 3 kg/dm³ BS 0.5 μm to 1 μm at least4 kg/dm³ BT 0.5 μm to 1 μm at least 5 kg/dm³ BU 0.5 μm to 1 μm 2 kg/dm³to 9 kg/dm³ BV 0.5 μm to 1 μm 3 kg/dm³ to 9 kg/dm³ BW 0.5 μm to 1 μm 4kg/dm³ to 9 kg/dm³ BX 0.5 μm to 1 μm 5 kg/dm³ to 9 kg/dm BY 0.7 μm to0.9 μm at least 2 kg/dm³ BZ 0.7 μm to 0.9 μm at least 3 kg/dm³ CA 0.7 μmto 0.9 μm at least 4 kg/dm³ CB 0.7 μm to 0.9 μm at least 5 kg/dm³ CC 0.7μm to 0.9 μm 2 kg/dm³ to 9 kg/dm³ CD 0.7 μm to 0.9 μm 3 kg/dm³ to 9kg/dm³ CE 0.7 μm to 0.9 μm 4 kg/dm³ to 9 kg/dm³ CF 0.7 μm to 0.9 μm 5kg/dm³ to 9 kg/dm

TABLE C Feature D90 distribution Density DA 5 μm or less at least 2kg/dm³ DB 5 μm or less at least 3 kg/dm³ DC 5 μm or less at least 4kg/dm³ CD 5 μm or less at least 5 kg/dm³ DE 5 μm or less 2 kg/dm³ to 9kg/dm³ DF 5 μm or less 3 kg/dm³ to 9 kg/dm³ DG 5 μm or less 4 kg/dm³ to9 kg/dm³ DH 5 μm or less 5 kg/dm³ to 9 kg/dm DI 3 μm or less at least 2kg/dm³ DJ 3 μm or less at least 3 kg/dm³ DK 3 μm or less at least 4kg/dm³ DL 3 μm or less at least 5 kg/dm³ DM 3 μm or less 2 kg/dm³ to 9kg/dm³ DN 3 μm or less 3 kg/dm³ to 9 kg/dm³ DO 3 μm or less 4 kg/dm³ to9 kg/dm³ DP 3 μm or less 5 kg/dm³ to 9 kg/dm DQ 0.5 μm to 5 μm at least2 kg/dm³ DR 0.5 μm to 5 μm at least 3 kg/dm³ DS 0.5 μm to 5 μm at least4 kg/dm³ DT 0.5 μm to 5 μm at least 5 kg/dm³ DU 0.5 μm to 5 μm 2 kg/dm³to 9 kg/dm³ DV 0.5 μm to 5 μm 3 kg/dm³ to 9 kg/dm³ DW 0.5 μm to 5 μm 4kg/dm³ to 9 kg/dm³ DX 0.5 μm to 5 μm 5 kg/dm³ to 9 kg/dm DY   1 μm to 3μm at least 2 kg/dm³ DZ   1 μm to 3 μm at least 3 kg/dm³ EA   1 μm to 3μm at least 4 kg/dm³ EB   1 μm to 3 μm at least 5 kg/dm³ EC   1 μm to 3μm 2 kg/dm³ to 9 kg/dm³ ED   1 μm to 3 μm 3 kg/dm³ to 9 kg/dm³ EE   1 μmto 3 μm 4 kg/dm³ to 9 kg/dm³ EF   1 μm to 3 μm 5 kg/dm³ to 9 kg/dm

In embodiments, the luminescent particles may be present in the platingsolution in an amount of 1 gram (g) or more of luminescent particles perLitre (L) of plating solution (i.e., 1 g/L or more), optionally 2 g/L ormore, optionally 3 g/L or more, optionally 4 g/L or more, optionally 5g/L or more. In embodiments, the luminescent particles may be present inthe plating solution in an amount of 10 g or less of luminescentparticles per L of plating solution (i.e., 10 g/L or less), optionally 8g/L or less, optionally 7 g/L or less, optionally 6 g/L or less,optionally 5 g/L or less. In embodiments, the luminescent particles maybe present in the plating solution in an amount of 1 g to 10 gluminescent particles per L of plating solution (i.e., 1 g/L to 10 g/L),optionally 2 g/L to 8 g/L, optionally 3 g/L to 6 g/L. Therefore, thisspecification hereby discloses a combination of each amount or rangementioned in this paragraph with each item of information hereinrelating to luminescent particle size and with each of the followingfeatures of Tables A, B and C: A, B, C, D, E, F, G, H, I, J, K, L, M, N,O, P, Q, R, S, T, U, V, W, X, Y, Z, AA, A, AC, AD, AE, AF, BA, BB, BC,BD, BE, BF, BG, BH, BI, BJ, BK, BL, BM, BN, BO, BP, BQ, BR, BS, BT, BU,BV, BW, BX, BY, BZ, CA, CB, CC, CD, CE, CF, DA, DB, DC, DD, DE, DF, DG,DH, DI, DJ, DK, DL, DM, DN, DO, DP, DQ, DR, DS, DT, DU, DV, DW, DX, DY,DZ, EA, EB, EC, ED, EE, EF.

The type of liquid medium utilized in embodiments of the presentinvention is not particularly restricted. The liquid medium may compriseor be water. The plating solution may be at a pH of from 2 to 6,optionally a pH of from 3 to 5, optionally a pH of from 3.5 to 4.5,optionally about 4.

The electric current density while plating the plurality of articles maybe from 0.1 A/dm² to 1.5 A/dm², optionally from 0.3 A/dm² to 1 A/dm²,optionally from 0.3 A/dm² to 0.5 A/dm², optionally about 0.4 A/dm².Therefore, this specification hereby discloses a combination of eachamount or range mentioned in this paragraph with each item ofinformation herein relating to luminescent particle size and with eachof the following features of Tables A, B and C: A, B, C, D, E, F, G, H,I, J, K, L, M, N, O, P, Q, R, S, T, U, V, W, X, Y, Z, AA, A, AC, AD, AE,AF, BA, BB, BC, BD, BE, BF, BG, BH, BI, BJ, BK, BL, BM, BN, BO, BP, BQ,BR, BS, BT, BU, BV, BW, BX, BY, BZ, CA, CB, CC, CD, CE, CF, DA, DB, DC,DD, DE, DF, DG, DH, DI, DJ, DK, DL, DM, DN, DO, DP, DQ, DR, DS, DT, DU,DV, DW, DX, DY, DZ, EA, EB, EC, ED, EE, EF.

In embodiments of the present invention, before or during plating of theplurality of articles, the plating solution may be subjected to anultrasound, or ultrasonic, (“US”) treatment (also referred to herein assonication). Subjecting the plating solution to ultrasound treatmentbefore the plating process commences was found to produce a very stablesuspension of the particles in the plating solution, which in turn ledto higher luminescent signals from the luminescent particles in thefinal plated articles. Subjecting the plating solution to ultrasoundtreatment during the plating process was found in embodiments to reducethe depth of the initial luminescent particle-free portion (layer) ofthe metallic layer (see, e.g., layer B in FIG. 3). Such an initial layeris a natural result of the plating process in which this initialnucleation, or seed, layer becomes deposited first with only the metalparticles as the metal cations from the plating solution undergo anelectronic reduction on the surface of the cathode (i.e., the articlebeing plated) to form the metallic plated layer. After this initiallayer forms, then the luminescent particles will be incorporated intothe growing metal matrix (the metal plated layer) as they come incontact with the cathode surface as a result of being suspended in theplating solution. Since this initial luminescent particle-free portionis non-functional (i.e., does not emit electromagnetic energy), it isdesired in embodiments that the thickness, or depth, of this initiallayer be minimized.

The plating solution may be subjected to ultrasound treatment beforecommencing the formation of the metallic layer (i.e., plating process)(e.g., for a period of at least 30 minutes), optionally for a period ofat least 1 hour before commencing the formation of the metallic layer,optionally for a period of at least 3 hours before commencing theformation of the metallic layer, optionally for a period of at least 4hours before commencing the formation of the metallic layer, optionallyfor a period of at least 5 hours before commencing the formation of themetallic layer.

The ultrasound treatment may be applied during the plating process forthe whole period of the plating or during only part of the period of theplating. The ultrasound may be applied during an initial period of theplating, for example for a period of from 5 minutes to an hour, forexample for a period of from 15 minutes to an hour from commencement ofthe plating of the articles, with the entire plating process taking 2hours or more, or until a desired depth of the metallic layer isdeposited on the substrate of the article (e.g., disc). For example, theultrasound treatment may be applied for a period of at least 15 minutesfrom commencement of the plating of the articles. In embodiments, afterthe plating solution has been subjected to the ultrasound treatmentduring plating of the articles, the plating of the articles continuesuntil a predetermined depth of the metallic layer has been deposited onthe articles. The ultrasound treatment may be applied during thetreatment for a time mentioned in this paragraph and before thetreatment for a time mentioned in the immediately preceding paragraph.

Before and/or during the plating process, the frequency of the appliedultrasound treatment may be at least 10 kHz, optionally at least 15 kHz,optionally from 10 kHz to 30 kHz, optionally from 15 kHz to 25 kHz,optionally about 20 kHz. The ultrasound frequency as disclosed in thisparagraph may be applied before the treatment for a time previouslydisclosed herein. The ultrasound frequency as disclosed in thisparagraph may be applied during the treatment for a time previouslydisclosed herein. The ultrasound frequency as disclosed in thisparagraph may be applied before the treatment for a time previouslydisclosed herein and during the treatment for a time previouslydisclosed herein.

Before and/or during the plating process, the power of the appliedultrasound treatment may be at least 100 W, optionally at least 200 W,e.g. at least 1000 W, optionally at least 1400 W. Before or during theplating process, the power of the applied ultrasound treatment may be avalue from 100 W to 2000 W (e.g. 1000 W or 1400 W to 2000 W), optionallya value from 100 W to 1800 W, optionally a value from 200 W to 700 W,optionally about 500 W. The ultrasound power as disclosed in thisparagraph may be applied before the treatment for a time previouslydisclosed herein. The ultrasound power as disclosed in this paragraphmay be applied during the treatment for a time previously disclosedherein. The ultrasound power as disclosed in this paragraph may beapplied before the treatment for a time previously disclosed herein andduring the treatment for a time previously disclosed herein.

Ultrasound treatment applied before the process, ultrasound treatmentapplied during the process or ultrasound treatment as applied bothbefore and during the process may be applied at a combination offrequency and power disclosed in the following Table D:

TABLE D Frequency Power at least 10 kHz at least 100 W at least 15 kHzat least 100 W from 10 kHz to 30 kHz at least 100 W from 15 kHz to 25kHz at least 100 W about 20 kHz at least 100 W at least 10 kHz at least200 W at least 15 kHz at least 200 W from 10 kHz to 30 kHz at least 200W from 15 kHz to 25 kHz at least 200 W about 20 kHz at least 200 W from10 kHz to 30 kHz at least 200 W at least 10 kHz at least 1400 W at least15 kHz at least 1400 W from 10 kHz to 30 kHz at least 1400 W from 15 kHzto 25 kHz at least 1400 W about 20 kHz at least 1400 W at least 10 kHzfrom 100 W to 2000 W at least 15 kHz from 100 W to 2000 W from 10 kHz to30 kHz from 100 W to 2000 W from 15 kHz to 25 kHz from 100 W to 2000 Wabout 20 kHz from 100 W to 2000 W at least 10 kHz from 100 W to 1800 Wat least 15 kHz from 100 W to 1800 W from 10 kHz to 30 kHz from 100 W to1800 W from 15 kHz to 25 kHz from 100 W to 1800 W about 20 kHz from 100W to 1800 W at least 10 kHz from 200 W to 700 W at least 15 kHz from 200W to 700 W from 10 kHz to 30 kHz from 200 W to 700 W from 15 kHz to 25kHz from 200 W to 700 W about 20 kHz from 200 W to 700 W at least 10 kHzabout 500 W at least 15 kHz about 500 W from 10 kHz to 30 kHz about 500W from 15 kHz to 25 kHz about 500 W about 20 kHz about 500 W at least 10kHz about 500 W at least 15 kHz about 500 W from 10 kHz to 30 kHz about500 W from 15 kHz to 25 kHz about 500 W about 20 kHz about 500 W

The ultrasound treatment as disclosed in Table D may be applied beforethe treatment for a time previously disclosed herein. The ultrasoundtreatment as disclosed in Table D may be applied during the treatmentfor a time previously disclosed herein. The ultrasound treatment asdisclosed in Table D may be applied before the treatment for a timepreviously disclosed herein and during the treatment for a timepreviously disclosed herein.

The ultrasound treatment disclosed in each row of Table D may becombined with an electric current density while plating the plurality ofarticles of from 0.1 A/dm² to 1.5 A/dm², optionally from 0.3 A/dm² to 1A/dm², optionally from 0.3 A/dm² to 0.5 A/dm², optionally about 0.4A/dm².

This specification hereby discloses a combination of ultrasoundfrequency mentioned in this specification with each item of informationherein relating to luminescent particle size and with each of thefollowing features of Tables A, B and C: A, B, C, D, E, F, G, H, I, J,K, L, M, N, O, P, Q, R, S, T, U, V, W, X, Y, Z, AA, A, AC, AD, AE, AF,BA, BB, BC, BD, BE, BF, BG, BH, BI, BJ, BK, BL, BM, BN, BO, BP, BQ, BR,BS, BT, BU, BV, BW, BX, BY, BZ, CA, CB, CC, CD, CE, CF, DA, DB, DC, DD,DE, DF, DG, DH, DI, DJ, DK, DL, DM, DN, DO, DP, DQ, DR, DS, DT, DU, DV,DW, DX, DY, DZ, EA, EB, EC, ED, EE, EF.

This specification hereby discloses a combination of ultrasound powermentioned in this specification with each item of information hereinrelating to luminescent particle size and with each of the followingfeatures of Tables A, B and C: A, B, C, D, E, F, G, H, I, J, K, L, M, N,O, P, Q, R, S, T, U, V, W, X, Y, Z, AA, A, AC, AD, AE, AF, BA, BB, BC,BD, BE, BF, BG, BH, BI, BJ, BK, BL, BM, BN, BO, BP, BQ, BR, BS, BT, BU,BV, BW, BX, BY, BZ, CA, CB, CC, CD, CE, CF, DA, DB, DC, DD, DE, DF, DG,DH, DI, DJ, DK, DL, DM, DN, DO, DP, DQ, DR, DS, DT, DU, DV, DW, DX, DY,DZ, EA, EB, EC, ED, EE, EF.

This specification hereby discloses a combination of the features ofeach row of Table D above with each item of information herein relatingto luminescent particle size and with each of the following features ofTables A, B and C: A, B, C, D, E, F, G, H, I, J, K, L, M, N, O, P, Q, R,S, T, U, V, W, X, Y, Z, AA, A, AC, AD, AE, AF, BA, BB, BC, BD, BE, BF,BG, BH, BI, BJ, BK, BL, BM, BN, BO, BP, BQ, BR, BS, BT, BU, BV, BW, BX,BY, BZ, CA, CB, CC, CD, CE, CF, DA, DB, DC, DD, DE, DF, DG, DH, DI, DJ,DK, DL, DM, DN, DO, DP, DQ, DR, DS, DT, DU, DV, DW, DX, DY, DZ, EA, EB,EC, ED, EE, EF.

In embodiments of the present invention, the plating solution may bestirred, e.g. in the container in which the plating of the articles iscarried out, at a speed below the critical angular speed at which avortex is formed within the plating solution. In fluid dynamics, avortex is a region within a fluid where the flow is mostly a spinningmotion about an imaginary axis, straight or curved. In embodiments, theplating solution is stirred by a stirrer rotating at a speed below 1800rpm. In embodiments, the plating solution is stirred by a stirrerrotating at a speed of from 500 to 1800 rpm. In embodiments of thepresent invention, stirring the plating solution below the criticalangular speed at which a vortex would form in the plating solution is astir speed that creates sufficient turbulence in the plating solution toprevent agglomeration of particles, but allows co-deposition of theluminescent particles and the plated metal.

In a further aspect, there is provided a method for plating articles,the method comprising providing a plating solution comprising a liquidmedium, a precursor species suitable for forming a metallic layer on thearticles, and a plurality of luminescent particles suspended in theliquid medium; and plating the articles within the plating solution,such that the precursor species forms the metallic layer on the articlesand the luminescent particles are deposited within the metallic layerwhile it is formed, wherein, before and/or during the plating of thearticles, the plating solution is agitated.

In an embodiment, in any of the aspects described herein, the platingsolution may be agitated before and/or during the formation of themetallic layer (i.e., plating process). In an embodiment, the platingsolution is agitated by subjecting the plating solution to high shear.High shear may be defined as any turbulent movement of the platingsolution, preferably turbulent flow that can cause deagglomeration ofagglomerated luminescent particles within the plating solution, whichmay be as defined herein. High shear may be defined as subjecting theplating solution to turbulent flow. The plating solution may be agitatedin the container in which the plating is carried out or in a separateunit, which may be termed an agitation unit herein. The plating solutionmay be agitated by a method selected from stirring the plating solution,shaking the plating solution, subjecting the plating solution toultrasound, and any other suitable method. In an embodiment, the platingsolution may be agitated by passing the plating solution through acentrifugal pump. In an embodiment, the plating solution is agitated byrotating an impeller in the plating solution, and preferably wherein theimpeller has at least one blade that has, preferably a plurality ofblades and each of which has, a surface that is substantially at a rightangle to the plane that is at a right angle to the axis of rotation ofthe blade. In other words, the impeller may have an axis of rotation,and a plane can be defined such that the axis of rotation isperpendicular to the plane, and the impeller has one or more blades thathas a surface that is substantially at a right angle to said plane. Suchimpellers may sometimes be referred to as high shear impellers, sincethe blades of the impeller effect turbulent, rather than laminar, flowof a liquid. The one or more blades of the impeller may extend radiallyfrom the axis of the impeller, or extend from a sheet that lies in theplane to which the axis of rotation is perpendicular. “Substantially ata right angle” may indicate an angle of from 70° to 110°, optionallyfrom 80° to 100°, optionally from 85° to 95°, optionally about 90°. Inan embodiment, the plating solution is agitated by rotating an impeller,which may be a high shear impeller, in the plating solution with a tipspeed of at least 1 m/S, optionally a tip speed of at least 3 m/s,preferably a tip speed of at least 5 m/s. The impeller, which may be ahigh shear impeller and/or an impeller of the centrifugal pump, mayrotate with a tip speed of from 5 m/s to 50 m/s, optionally a tip speedof from 5 m/s to 40 m/s, optionally a tip speed of from 5 m/s to 40 m/s,optionally a tip speed of from 5 to 25 m/s. In an embodiment, theimpeller, e.g. the high shear impeller, is located within the containerin which the articles are plated. In an embodiment, the impeller, e.g.the high shear impeller, is located in a separate container from the onein which the articles are plated, i.e. the agitation unit.

In an embodiment, the plating solution is agitated by passing theplating solution through a homogenizer, preferably a high pressurehomogenizer. The homogenizer may be one that effects turbulent highvelocity flow, which subjects the plating solution to high shear. A highpressure homogenizer may involve passing the plating solution along aconduit under pressure until a point at which the flow is diverted at anangle of approximately 90°.

In an embodiment, plating is carried out while the articles are within areceptacle that is placed within the container of plating solution (thiscontainer being termed a plating container herein for brevity), and theplating solution, before and/or during the plating is diverted from thecontainer of plating solution to an agitation unit, in which the platingsolution is agitated, and then returned to the plating container, andoptionally the diverting of the plating solution to the agitation unitand return of the plating to the receptacle in which the articles arebeing plating is continuous, e.g. occurs during the entire plating ofthe metallic layer on the articles. In an embodiment, the plating iscarried out while the articles are within a receptacle that is placedwithin the container of plating solution, and the plating solution,before and/or during the plating is circulated from the container ofplating solution to an agitation unit, in which the plating solution isagitated, and then returned to the container of plating solution.

In an embodiment, plating is carried out while the articles are within areceptacle that is placed within the container of plating solution, andthe plating solution, during the plating, which may be for part or allof the plating to form the metallic layer, is diverted, e.g. along aconduit such as a pipe, e.g. by being pumped, from the container ofplating solution to an agitation unit in which the plating solution isagitated, and then returned to the plating container and optionally thediverting of the plating solution to the agitation unit and return tothe receptacle in which the articles are being plating is continuous.This can be even more effective than subjecting the plating solution toultrasound, since more of the luminescent particles from the platingsolution can incorporated into the metallic layer on the articles. Theagitation unit may comprise a means selected from an impeller, e.g. ahigh shear impeller, a centrifugal pump, an ultrasound unit forsubjecting the plating solution to ultrasound, a homogeniser (which mayuse high pressure to cause turbulent flow), a static mixer, and anyother means for subjecting the plating solution to turbulent flow. Astatic mixer is one in which a liquid is caused to flow past a series ofstatic baffles, the flow past the static baffles inducing turbulent flowin the liquid. The agitation unit may comprise a centrifugal pump, whichmay be as described below.

The agitation may involve a method selected from stirring, shaking,subjecting the plating solution to ultrasound, and any other suitablemethod, e.g. any other method that subjects the plating solution toturbulent flow.

In an embodiment, plating is carried out while the articles are within areceptacle that is placed within the container of plating solution, andthe plating solution, before and/or during the plating is diverted fromthe container of plating solution to a centrifugal pump, and thenreturned to the plating container, and optionally the diverting of theplating solution to the centrifugal pump and return of the plating tothe receptacle in which the articles are being plating is continuous.

A centrifugal pump can be a pump in which liquid (e.g. the platingsolution in the present application) is passed along a conduit, whichmay be along the direction of the axis of a rotating impeller, until itreaches a rotating impeller, the impeller then directing the liquidradially outward. After the liquid is directed radially outward, theliquid may be directed along a conduit to a desired location, e.g. backto the container in which the articles are being plated.

The centrifugal pump may comprise a rotating impeller that rotates aboutan axis, causing the plating solution to be directed radially outwardand, optionally, a stator, through which the plating solution flows asit is directed radially outward. If a centrifugal pump has a rotatingimpeller and a stator, this may be termed a ‘rotor stator’ herein. Astator remains substantially stationary while the impeller is rotating.The stator may be an annular body having a plurality of aperturesthrough which the plating solution flows as it is directed radiallyoutward. In an embodiment, the impeller comprises an annular body havinga plurality of apertures spaced circumferentially around the annularbody. In an embodiment, the impeller comprises an annular body having aplurality of apertures spaced circumferentially around the annular body,and the apertures are defined by walls that are optionally at an anglethat is offset from an angle that is radially outward from the axis ofthe impeller. In an embodiment, the stator comprises an annular bodyhaving a plurality of apertures spaced circumferentially around theannular body, and the apertures are defined by walls that are optionallyat an angle offset from an angle that is radially outward from the axisof the impeller.

In an embodiment, the impeller has a plurality of annular bodiesarranged concentrically, and each annular body may have a plurality ofapertures spaced circumferentially around the annular body, and,optionally, the stator has an annular body having a plurality ofapertures spaced circumferentially around the annular body and which isarranged between at least two of the concentrically arranged annularbodies of the impeller.

In an embodiment, the stator has a plurality of annular bodies arrangedconcentrically, each annular body having a plurality of apertures spacedcircumferentially around the annular body, and, optionally, the impellerhas an annular body having a plurality of apertures spacedcircumferentially around the annular body and which is arranged betweenat least two of the concentrically arranged annular bodies of thestator.

In an embodiment, the stator and impeller each has a plurality ofannular bodies arranged concentrically, each annular body having aplurality of apertures spaced circumferentially around the annular body,the annular bodies of the stator and impeller interlocking such thatthere is an alternate arrangement concentrically of stator annularbodies and impeller annular bodies. In such an arrangement, the platingsolution would pass radially alternately through the apertures of thestator and the impeller.

In an embodiment, the centrifugal pump does not have a stator.

The impeller of the centrifugal pump may rotate with a tip speed of atleast 1 m/S, optionally a tip speed of at least 3 m/s, preferably a tipspeed of at least 5 m/s. The impeller of the centrifugal pump may rotatewith a tip speed of from 5 m/s to 50 m/s, optionally a tip speed of from5 m/s to 40 m/s, optionally a tip speed of from 5 m/s to 40 m/s,optionally a tip speed of from 5 m/s to 25 m/s. Tip speed of an impellercan be defined as the peripheral speed, in m/s, of the part of theimpeller located furthest, radially, from the axis of rotation of theimpeller. Tip speed=the angular velocity (in revolutions persecond)×diameter of the impeller×π. It has been found that when using animpeller having a tip speed within the ranges stated above, a suitablebalance between high shear forces and flow rate can be found, such thathigh volumes of plating solution can be passed through the centrifugalpump, while still subjecting the plating solution to a reasonable amountof shear. This has been found to promote inclusion of a reasonably highamount of luminescent particles in the metallic layer.

In an embodiment, the container in which the plating is carried out, cancontain or contains a volume, V₁, of plating solution, and the platingsolution, before and/or during the plating, is circulated from thecontainer of plating solution to an agitation unit, which may be acentrifugal pump, in which the plating solution is agitated, and thenreturned to the container of plating solution, and the volume of liquidV₂ passed through the agitation unit, per hour is n×V₁, wherein n is atleast 1, optionally at least 3, optionally at least 5, optionally atleast 10, optionally at least 15. Optionally, n is from 3 to 25,optionally from 5 to 25. In an embodiment, the impeller of thecentrifugal pump rotates with a tip speed of at least 5 m/s, optionallyat least 10 m/s, optionally at least 15 m/s, optionally from 15 m/s to30 m/s, optionally from 15 m/s to 25 m/s and n is at least 10,optionally at least 15, optionally from 10 to 25, optionally from 15 to20. Optionally, the impeller of the centrifugal pump rotates with a tipspeed of from 15 m/s to 30 m/s and n is from 10 to 25, optionally from15 to 20.

The container in which the plating of the articles is carrier out maycontain at least 1 L of plating solution, optionally at least 5 L ofplating solution optionally at least 10 L of plating solution,optionally at least 15 L of plating solution, optionally at least 20 Lof plating solution, optionally at least 30 L of plating solution,optionally at least 50 L or plating solution, optionally at least 100 Lof plating solution, optionally at least 200 L of plating solution,optionally at least 250 L of plating solution, optionally at least 300 Lof plating solution. It has been found that ultrasound techniques, asdescribed herein, are particularly effective when the volume of platingsolution is up to about 20 L. However, when the volume of platingsolution is more than 20 L, while ultrasound techniques still work, theybecome less efficient and can be more costly. It was a challengetherefore to devise a technique that would allow the same or similarefficacy as ultrasound, while being more energy efficient thanultrasound and not adversely affecting the plating of the metallic layerand deposition of the luminescent particles. The circulation of theplating solution to the agitation unit, as described herein, was foundto provide a suitable alternative to ultrasound, and can be used at allvolumes of plating solution, including high volumes, e.g. of at least100 L, e.g. at least 300 L.

The plating may be carried out while the articles are within areceptacle that is placed within the container of plating solution, andthe plating solution diverted, or circulated, to an agitation unit andthen returned to the container of the plating solution (in which theplating is carrier out), and optionally, the receptacle moves within theplating solution. The receptacle may act to tumble the articles withinthe receptacle during the plating. In embodiments, the receptaclerotates within the plating solution. Such a receptacle may be in theform of a barrel. This may be termed barrel plating. The articles may befree to move within the receptacle (e.g., barrel) such that when thereceptacle rotates, the articles move (e.g., rotate and/or tumble)within the receptacle relative to one another. This has been found toprovide a relatively consistent plate thickness on all sides of thearticles.

In an embodiment, plating is carried out while the articles are within areceptacle that is placed within the container of plating solution, andthe plating solution, either before or during the plating is diverted,e.g. circulated, from the receptacle to an agitation unit, e.g, acentrifugal pump, in which the plating solution is agitated, and thenreturned to the plating container, and the receptacle moves, e.g.rotates, within the plating solution, preferably moves, e.g. rotates,continuously (optionally rotating at a constant speed) within theplating solution throughout the entire duration of the plating. Thereceptacle (e.g., barrel) may rotate at a speed of 1 to 50 rpm,optionally from 4 to 30 rpm, optionally from 4 to 15 rpm, optionallyfrom 4 to 12 rpm, optionally from 6 to 10 rpm, optionally about 8 rpm.The rate of rotation may be varied during plating or be held constant,for example for the entire duration of the plating. The articles may befree to move within the receptacle (e.g., barrel) such that when thereceptacle rotates, the articles move (e.g., rotate and/or tumble)within the receptacle relative to one another.

In an aspect, there is provided an apparatus, which may be for carryingout the method of any of the aspects described herein. In an embodiment,the apparatus comprises:

a container for holding a plating solution,

a means, e.g. a receptacle, for holding a plurality of articles withinthe plating solution, and, optionally,

a means for agitating the plating solution before and/or during theplating.

The container for holding a plating solution may be termed a platingcontainer herein for brevity. The apparatus may comprise a means forapplying an electrical potential to the articles when they are withinthe container of the plating solution, e.g. such that electroplating maybe carried out.

The means, e.g. receptacle, for holding a plurality of articles withinthe plating solution may be configured to move continuously during theplating process. The means, e.g. receptacle, for holding a plurality ofarticles may be configured to rotate on an axis that is substantiallyhorizontal. The means, e.g. receptacle, for holding a plurality ofarticles may be configured to move (e.g., rotate) at a constant rateduring the plating. Optionally, the receptacle is or comprises a barreland the apparatus is adapted such that the articles are continuouslyrotated in a barrel, and optionally at a constant rate, during theplating of the plurality of articles. Optionally, the rotation of thebarrel is periodically interrupted. The receptacle (e.g., barrel) mayrotate at a speed of 1 to 50 rpm, optionally from 4 to 30 rpm,optionally from 4 to 15 rpm, optionally from 4 to 12 rpm, optionallyfrom 6 to 10 rpm, optionally about 8 rpm. The rate of rotation may bevaried during plating or be held constant, for example for the entireduration of the plating.

The means for agitating the plating solution may be a means forsubjecting the plating solution to an ultrasound treatment, and theapparatus may be adapted to apply the ultrasound to the plating solutionas described herein, e.g. before and/or during the plating of thearticles.

In an embodiment, the apparatus comprises a means for agitating theplating solution, and the means may be adapted to agitate the platingsolution as described herein, e.g. adapted such that the platingsolution is agitated before and/or during the formation of the metalliclayer (i.e., plating process). In an embodiment, the means for agitatingthe plating solution may be within the container for holding the platingsolution in which the articles are plated. In an embodiment, the meansfor agitating the plating solution is located in an agitation unit, thatis separate from the container for holding the plating solution in whichthe articles are plated, and the apparatus may be adapted to divert,e.g. circulate, the plating solution from the container for holding theplating solution in which the articles are plated to the agitation unit,in which the plating solution is agitated, and then returned to thecontainer for holding the plating solution in which the articles areplated (which may be termed a plating container herein, for brevity).The means for agitating the plating solution may comprise an impeller,which may be adapted to operate as described herein. The means foragitating the plating solution may comprise a centrifugal pump, whichmay be adapted to operate as described herein.

“Adapted such that” and other similar phrases may indicate that theapparatus is able to perform a particular operation, and, in embodiment,is programmed to perform a particular operation.

In an aspect, there is provided an apparatus, which may be for carryingout the method of any of the aspects described herein, the apparatuscomprising:

a container for holding a plating solution,

a receptacle for holding a plurality of articles within the platingsolution, and,

a means for agitating the plating solution before and/or during theplating

wherein the receptacle for holding a plurality of articles within theplating solution is configured to move continuously during the platingprocess,

wherein the means for agitating the plating solution before and/orduring the plating, is a means for subjecting the plating solution to anultrasound treatment, and/or the means for agitating the platingsolution is located an agitation unit, that is separate from thecontainer for holding the plating solution in which the articles areplated, and the apparatus is adapted to divert, e.g. circulate, theplating solution from the container for holding the plating solution inwhich the articles are plated to the agitation unit, in which theplating solution is agitated, e.g. before and/or during plating of thearticles, and then return the plating solution to the container forholding the plating solution in which the articles are plated. The meansfor agitating the plating solution in the agitation unit may comprise animpeller, which may be adapted to operate as described herein. The meansfor agitating the plating solution in the agitation unit may comprise acentrifugal pump, which may be adapted to operate as described herein.

As described herein, embodiments of the present invention provide aplating solution comprising a liquid medium, a precursor species forforming a metallic layer during a plating process, and a plurality ofluminescent particles suspended in the liquid medium, at least some ofwhich have diameters of 10 μm or less. The liquid medium, a precursorspecies, metallic layer, plating process, and luminescent particles maybe as described herein.

In embodiments, at least some of the luminescent particles in theplating solution have diameters of 5 μm or less. In embodiments, atleast some of the luminescent particles in the plating solution havediameters of 0.5 μm to 1 μm.

In embodiments, in the plating solution, the precursor species are forforming the metallic layer during a plating process, wherein themetallic layer may comprise a metal selected from zinc, copper, tin,nickel, and alloys of one or more thereof.

Articles plated in accordance with some embodiments of the presentinvention have a homogenous distribution (this may also be referred toherein as a uniform or statistically random distribution, or spatialhomogeneity) of luminescent particles throughout the metallic layer.Embodiments of the present invention may produce plated articles with ahomogenous distribution by utilizing a combination of a particularparticle size range of luminescent particles (e.g., particles having adiameter of from 0.5 μm to 1 μm) and constant motion of the articles(e.g., in a receptacle that rotates continuously) during the platingprocess. As is further discussed herein, the level of luminescent signalemitted from the luminescent particles co-deposited into the platedmetal layer may be proportional to the volume percent of luminescentparticles incorporated into the plated layer. As is also discussedhereinafter, to achieve at least a good quality finish of the platedlayer and a constant signal throughout the lifetime of utilization ofthe plated article, these luminescent particles have a homogenousdistribution in the plated layer. As a corollary, a plated article witha homogenous distribution of luminescent particles in the plated metallayer will typically produce a more consistent luminescent signal as theplated article wears in use over time (e.g., a coin in publiccirculation).

A homogenous distribution of the luminescent particles co-depositedwithin the plated metal layer may be determined using a variety ofmethods. Robust statistical methods to determine the levels of spatialhomogeneity are readily available, for example, nearest neighbor methodsand Ripley's k-function. Referring to FIGS. 9-10, another method fordetermining whether an article plated in accordance with embodiments ofthe present invention has a homogenous distribution of co-depositedluminescent particles is to separate a cross-section of the platedarticle into three relatively equidistant layers. In FIGS. 9-10, theseequidistant layers are indicated by the four horizontal black linesacross the images of the exemplary plated samples. Comparison of theapproximate percentages of the plated layer occupied by luminescentparticles (the light spots) in each layer provides an estimate of thehomogeneity. Analysis of the percentage in each layer may be determinedusing image processing software, such as the GNU® Image ManipulationProgram or Adobe® Photoshop. FIG. 9 shows a digital image of across-section of an article plated with a metal layer co-deposited withluminescent particles in accordance with embodiments of the presentinvention, wherein it can be readily observed that there is a homogenousdistribution of the luminescent particles throughout the plated metallayer. In contrast, FIG. 10 shows a digital image of a cross-section ofan article plated with a metal layer co-deposited with luminescentparticles, wherein it can be readily observed that there is not ahomogenous distribution of the luminescent particles throughout theplated metal layer.

As described herein, embodiments of the present invention provide anarticle having an electroplated metallic layer thereon, whereinluminescent particles are dispersed in the electroplated layer, whereinat least some of luminescent particles have a diameter of 10 μm or lessand the distribution of the luminescent particles in the plated metallayer is homogenous (except for the initial luminescent particle-freelayer). The article may be producible in accordance with methodsdescribed herein. The article, the metallic layer, and the luminescentparticles may be as described herein.

Referring to FIG. 3 as an example, embodiments of the present inventionprovide an article (layer C) having an electroplated metallic layer(layers A and B) thereon, where luminescent particles are dispersed inthe electroplated layer in a first portion (layer A) of theelectroplated layer, and a second portion (layer B) of the electroplatedlayer substantially absent of luminescent particles (the initialluminescent particle-free layer) is disposed between the first portion(layer A) and the article (layer C), wherein the depth of the secondportion (layer B) may be less than 4 μm. The plated article may beproducible in accordance with methods described herein. The article, themetallic layer, and the luminescent particles may be as describedherein. In embodiments, the article may be in the form of a disc. Inembodiments, the article may be in the form of a disc having athree-dimensional pattern stamped thereon after formation of the platedmetallic layer. In embodiments, the article may comprise steel, and themetallic layer may comprise a metal selected from zinc, copper, tin,nickel, and an alloy selected from one or more thereof.

Embodiments of the present invention will now be further described withreference to the following non-limiting Examples (also referred toherein as “experiments,” “trial runs,” “trials,” and “runs”) andaccompanying Figures.

EXAMPLES Example 1

The following non-limiting Examples may utilize variations of theplating steps illustrated in FIG. 11. As has already been discussed, andas will be further described hereinafter, a plating solution is preparedin step 1101 with inclusion of the metal particles to be plated and theaccompanying luminescent particles. Sonication of the plating solutionmay be performed in step 1102 in various implementations describedherein. The plating solution may also be stirred, or agitated, in step1103 in various implementations described herein. The plating process isperformed in step 1104 in various implementations described herein. And,if required for the final plated article, the plated article may bepatterned (e.g., mechanically stamped or striked) in step 1105, whereinthe plated layer is also subjected to such patterning.

Luminescent particles having a D90 distribution of approximately 10.636microns and a mean particle size of approximately 8.95 microns weredosed into Nickel Sulphamate at approximately 15 g/I and agitated,stirred, and sonicated for approximately 6 hours; the solution was thenleft to settle. After 1 hour, the top 50% of solution was decanted intoa separate vessel. This top solution was then passed through severalpaper cartridge filters to reduce the mean particle size. This finalfiltrate was then evaporated and the remaining concentrate dosed intoNickel Sulphamate to electroplate articles (e.g., coinage) withluminescent particles of a reduced size. This particle size was verifiedby SEM analysis of the plated articles.

The luminescent particles were a doped lanthanide oxysulfide. A matrixof experiments was designed and carried out (also referred to herein as“trials,” “trial runs,” or “plating runs” or similar terminology)firstly using a Nickel Sulphamate based plating solution, Copper(cyanide), and then direct Brass (cyanide) plating solutions.

The steel metal articles (e.g., coin blanks) were weighed and thentransferred to a plating barrel. Before this, they may be cleaned in analkaline cleaner at approximately 60° C. to remove any cutting oil,which may have remained. The steel articles (which may be mild steel)then may be rinsed in demineralised water also at approximately 60° C.and then acid etched (e.g., using a 120 g/I solution of sulphuric acidat 50° C.). The steel articles were then transferred to the plating bathand an electrical current applied. The plating barrel continuallyrotated with no interruption to the current or rotation during theentire plating operation.

After the plating cycle was complete, the plated articles were removedfrom the plating solution and again rinsed in hot demineralised water.They were then dried (e.g., transferred to a lab tray and placed in ahot air drier until dry). They were then annealed (e.g., heated in acontrolled atmosphere) to soften the base metal and plated layer,producing an oxide layer on the surface of the plated article. Thisoxide layer may be removed during a finishing process (e.g., using anacid soap and stainless steel media in a rotary high energy finisher).The finished plated article, depending on a customer requirement, may besupplied finished as a blank (e.g., coin blank) or struck with a pattern(e.g., to produce coinage).

The plated articles, when cold, were re-weighed, and examined for platethickness (e.g., using X-ray fluorescence (“XRF”)). Signal strength(emitted electromagnetic energy) from the luminescent particlesco-deposited in the plated layer was measured (e.g., with an appropriatesignal measuring device capable of measuring electromagnetic energy, orat least relative signal strengths emitted from each article). Theplated articles were then further processed and struck with a pattern.The luminescent signal strength was measured at each such stage, and theplated articles were cut into cross-sections and examined (e.g., under ascanning electron microscope (“SEM”)).

From analysis of the results of the experiments, optimum conditions,parameters, and variables were derived. A series of confirmation platingruns were carried out to confirm the findings. Further details on theexperiments carried out, and the results, are provided below.

FIG. 1 illustrates schematically an apparatus 100 that may be used forcarrying out the plating process in accordance with embodiments of thepresent invention, which may utilize the following list of commerciallyavailable items. Embodiments of the present invention are not limited tothis specific configuration. The apparatus 100 includes a receptacle 101for retaining the plating solution, a tumbler (e.g., rotary) 102 fortumbling the articles within the plating solution during the platingprocess, an electrode 103 that acts as a cathode during the platingprocess, this electrode extending into the barrel of the rotary tumbler,a power source 104, a further electrode 105 (e.g., in the form of abasket), which acts as an anode during the plating process, atemperature transmitter (“TT”) device 106 for temperature measurement(e.g., a Pt100 sensor), which is linked via a connector 108 to atemperature controller (“TC”) device 107, a stirrer 109, a pump 110 thatcirculates plating solution (e.g., around a conduit 111 and a valve 112,which may be a pneumatic valve).

Though the equipment and setup for carrying out the embodiments of thepresent invention are not limited to the following specifics, theexperiments utilized the following apparatuses and setups:

-   -   Hotplate—Jenway 572 hotplate and stirrer.    -   Scales—Kern 572 precision balance.    -   Tumbler—Beach 2.25 kg Barrel Tumbler.    -   Pump—2×EHeim 300 l/hr, 600 l/hr.    -   Pump—Positive Displacement filter pump.    -   16 L Poly-propylene plating bath.    -   Stirrer—Stuart General Purpose Ss10.    -   Sonotrode—Heilscher UIP1000hd (for creating ultrasound        vibrations).    -   Electronic Stopwatch/Countdown Timer.    -   Plating rig/barrel—Schloetter.    -   Anode basket—Schloetter Grade 1 titanium 300×150×25 mm    -   Heater—Braude Thermomaster controller and 1 kW heater.    -   Rectifier—AE-PS 3016-10 B.    -   pH—Mettler Toledo seven easy pH meter.    -   XDC—Fischerscope X-ray system XDL.    -   Belt annealing furnace—Wellman.    -   Stainless steel finishing media (4 mm, in the form of balls).    -   Trial press or production coin press—Schuler.    -   Luminescent measurement device—an LED and filtered photodiode        detector appropriately chosen for the particular luminescent        material that is used    -   Scanning Electron Microscope (“SEM”)—Phillips.

Though the materials and methods for carrying out the embodiments of thepresent invention are not limited to the following specifics, theexperiments utilized the following materials and methods:

(a) Materials

-   -   Caustic based cleaner 5% vol.    -   Sulphuric Acid 120 g/L.    -   Luminescent particles.    -   Surfactants/Wetting Agents.    -   Plating Bath Solutions—See Table 1.    -   pH control chemicals—(e.g., sulphamic acid)    -   Acid soap.    -   Articles for plating (e.g., mild steel parts).

Exemplary chemical bath compositions for the plating baths (solutions)are reproduced in Table 1.

TABLE 1 SPECIFICATIONS Low High Zinc Plating ZINC g/l 8 44 EL/ETCH ACIDg/l 10 180 TANK 13 Zn g/l 0 32 EL/CLEAN % 1 20 HYDROXIDE g/l 65 370CARBONATE g/l 40 440 OC 1150 Conc. 0 0.6 Copper Plating CYANIDE g/l 2 5COPPER g/l 15 180 CARBONATE g/l 12 200 EL/ETCH ACID g/l 55 400 CLEANER 1% 2 20 CLEANER 2 % 2 20 EL/CLEAN % 2 20 HYDROXIDE g/l 4 32 OC 1150 Conc.0 0.6 Nickel Plating TOTAL NICKEL g/l 30 200 NICKEL CHLORIDE g/l 2 30BORIC ACID g/l 12 70 IRON ppm 0 100 pH 2.5 6.5 EL/ETCH ACID g/l 55 400CLEANER 1 % 2 20 CLEANER 2 % 2 20 EL/CLEAN % 2 20 SULPHAMIC ACID g/l 50360

(b) Method (note that many of the following steps are optional), whichessentially implements the process shown in FIG. 11.

-   -   (i) A standard plating bath or solution (e.g., 16 L) was        prepared having one of the compositions indicated in Table 1.    -   (ii) A desired amount of luminescent particles (taggant),        surfactants, and other additives were added to the plating bath        (the taggant was present in an amount of approximately 3 to 6        g/L).

(iii) The articles were weighed and counted. A typical load for theplating barrel was between 150-450 g of articles.

(iv) The sonotrode was set to the required amplitude and timed forpre-sonication of the plating bath.

(v) Cutting oil was removed from the articles with a caustic-basedcleaner. The cleaner was heated to approximately 60° C. The articles andcleaner were and loaded into a receptacle. The receptacle was loadedinto an offline tumbler and rotated at a speed of approximately 10 rpmfor 10 minutes.

(vi) The cleaner was removed from the articles with demineralised water.

(vii) The surfaces of the articles were activated with sulphuric acid.The acid was heated to approximately 50° C. The articles and the acidwere and loaded into a receptacle. The receptacle was loaded into anoffline tumbler and rotated at a speed of approximately 10 rpm for 5minutes.

(viii) The acid was removed from the articles with demineralised water.

(ix) The articles were loaded into the plating barrel, attached to theplating rig and submerged in the electrolyte (plating bath).

(x) The sonotrode was set to the required amplitude for plating.

(xi) The required current was set by manipulation of the rectifiercurrent output and a resulting voltage was applied across the articles.

(xii) A number of standard analytical methods were performed to ensurethat respective solute concentrations in the electrolyte (plating bath)were within the desired specification limits (e.g., see Table 2).

(xiii) pH was measured with the Mettler Toledo pH probe and controlledwith chemical additions specific to the plating bath chemistry.

(xiv) After the required residence time was reached, the current wasstopped, and the plating barrel removed from the rig and rinsed indemineralised water.

(xv) The rinsed plated articles were towel dried, placed onto a metaltray and dried at approximately 120° C. until all water was removed.

(xvi) The plated articles were allowed to cool and then re-weighed todetermine the change in mass.

(xvii) Plate thicknesses were determined by the XRF from a sample of 25plated articles.

-   -   (xviii) Luminescent signal amplitude was determined using the        measurement device from a sample of the 25 plated articles.

(xix) Three quarters of the plated articles were annealed using a BeltFurnace with a reducing atmosphere and a maximum furnace temperature ofapproximately 850° C.

(xx) Luminescent signal amplitude was determined on a sample of the 25annealed and plated articles using the measurement device; the signalresults were again recorded on the lab data sheet.

(xxi) Two thirds of the annealed and plated articles were loaded into areceptacle with a 1:1 mass ratio of stainless steel media.

(xxii) Additions of approximately 25 ml of demineralised water andapproximately 0.5 ml of acid soap was added to the receptacle which wasrun for approximately 15 minutes at 10 rpm in the tumbler to simulate afinishing procedure on surfaces of the annealed and plated articles.

(xxiii) Luminescent signal amplitude was again determined using themeasurement device from a sample of the finished articles.

(xxiv) Some of the finished articles were pressed with a pattern eitheron the production or trial Schuler press to strike a coin.

(xxv) Luminescent signal amplitudes were measured from a sample of thestruck coins using the measurement device.

Table 2 indicates the conditions for the plating processes in certaintrial runs carried out.

TABLE 2 Run Reference No. 1 16 17 Plate Type Nickel Nickel Nickel MetalDisc Data Diameter 17.59 17.59 17.59 mm Gauge 1.16 1.16 1.16 mm AverageInitial Weight 3.15 3.15 3.15 grams per part Initial Mass 173.99 310.93310.77 grams Parts Plated 55 100 100 pieces Pre Plating Data AlkalineCleaning Time 10 10 10 minutes Cleaner Temperature 60 60 60 ° C. CleanerConcentration 7.5 7.2 7.5 % Cleaner Type Alkaline Alkaline Alkalinebased based based Rotation Speed 10 10 10 rpm Acid Type H₂SO₄ H₂SO₄H₂SO₄ Acid Cleaning Time 5 5 5 minutes Acid Temperature 50 50 50 ° C.Acid Concentration 120 120 120 g/l Mill Rotation Speed 10 10 10 rpmInitial Sonication Before 0 0.5 0.5 hrs Run Bath Chemistry Nickeltitre - EDTA 34.3 26.1 26.4 ml Volume Chloride titre - AgNO₃ 1.4 4.61.325 ml Volume Boric Acid titre - NaOH 5.5 1.25 4.45 ml Volume pH 4.2 44.2 log₁₀(l/mol) Electrolyte Density 1.3 1.3 1.3 kg/dm³ Taggant Density8 8 8 kg/dm³ Wetting none none none Agent/Surfactant Bath SpecificationsAnode Basket Material Class 1 Class 1 Class 1 titanium titanium titaniumAnode Material Sulphur Sulphur Sulphur Depolarised DepolarisedDepolarised Ni Shot Ni Shot Ni Shot Anode Bag Material woven PP woven PPwoven PP Filter Type Cartridge Cartridge Cartridge Filter Size 1 1 1 μmFilter Material PP PP PP Heater Size 1000 1000 1000 Watts EvaporationRate 1 1 1 dm³/hr Bomb Diameter 8 8 8 mm Bomb Material Copper CopperCopper Dangler Length 50 50 50 mm Barrel Diameter 70 70 70 mm BarrelLength 100 100 100 mm Barrel Pore Size 0.5 0.5 0.5 mm Bath Volume 18 1818 dm³ Filter Size 1 1 1 μm Plating Data Ultrasound Power 2000 2000 2000Watts Plating Time 3 6 6 hours Current Density Std R.M. Std R.M. StdR.M. A/dm² Ultrasonic Frequency 20 20 20 kHz Temperature 60 60 60 ° C.Barrel Rotation Speed 8 8 8 rpm Sonication Amplitude 0 50 50 %Sonication prior to Run none none Yes Sonication first 30 mins none YesYes of Run Sonication for none Yes none remainder Run Stirrer 1250 12501250 rpm Filter Pumps 0 0 0 l/hr Recirculating Flowrate 0 60 60 l/hrFinal Mass 177.25 322.26 323.26 grams

Results

A plurality of trial runs were carried out generally utilizing theforegoing method, each with varying factors, such as taggant(luminescent) particle size, the use of ultrasound before and/or duringplating, electrochemical parameters such as current densities, andcreating turbulence (e.g., stirring) in the plating solution. Each trialrun was analysed after striking on a striking press (e.g., Schuler),luminescent signal measurements being taken before and after striking asa control. The luminescent signal strength was measured using ameasurement device. Details of some of the runs are outlined in Table 3.

TABLE 3 RUN US ON FOR US ON FOR REF. PARTICLE US PRIOR TO INITIALREMAINDER VISUALLY SIGNAL NO. SIZE PLATING 30 mins OF RUN SEDIMENTATIONACCEPTABLE? STRENGTH 1 Large OFF OFF OFF Total NO LOW 2 Large OFF OFFOFF Total NO LOW 3 Large OFF OFF OFF High NO LOW 4 Large OFF OFF OFFHigh NO LOW 5 Large OFF OFF OFF High NO LOW 6 Large OFF OFF OFF High NOLOW 7 Large OFF OFF OFF High NO LOW 8 Large OFF ON ON High NO LOW 9Large OFF OFF OFF High NO LOW 10 Large OFF ON ON High NO LOW 11 LargeOFF ON ON High NO LOW 12 Large OFF ON ON High NO LOW 13 Large OFF ON ONHigh NO LOW 14 Large OFF ON ON High NO LOW 15 Large OFF ON ON High NOLOW 16 Medium OFF ON ON High YES LOW 17 Medium ON ON OFF Low YES HIGHEST18 Medium ON ON OFF Low YES HIGHEST 19 Small ON ON ON Low YES MEDIUM 20Small ON ON ON Low YES MEDIUM 21 Small ON ON OFF Low YES MEDIUM 22 SmallOFF OFF ON Low YES HIGH 23 Small OFF OFF ON Low YES HIGH 24 Small OFFOFF ON Low YES MEDIUM 25 Small ON ON ON Low YES MEDIUM 26 Small ON ON ONLow YES MEDIUM 27 Small ON OFF OFF Low YES HIGH 28 Small ON OFF OFF LowYES MEDIUM 29 Small ON OFF OFF Low YES MEDIUM

As has been discussed herein, the quality of the finish of the platedarticle can be a determining factor for which parameters and variablesare to be implemented in embodiments of the present invention. The priorart has never determined what parameters and variables produce variousfinish qualities, whereas the inventors have done so. The Run ReferenceNos. 1, 16, and 17 in Table 3 correspond to these Run Reference Nos. inTable 2. Table 3 provides examples of plated articles that had variousfinish qualities and luminescent signal strengths, and which parameters,variables, etc. produced such finish qualities. Quality of Finishes ofplated articles were classified as “Very Poor,” “Poor,” “Good,” and“Excellent” quality of finishes. For a comparison of these quality offinish determinations produced on plated articles, refer to FIGS. 5-8.FIG. 5 shows a digital image of a plated and patterned, or struck, coinhaving a very poor quality of finish (e.g., the design of the pattern isimpaired, the finish has a matte finish, and there are large blemisheson the surface). FIG. 6 shows a digital image of a plated and patterned,or struck, coin having a poor quality of finish (e.g., the design of thepattern is impaired, the finish has a satin finish, and there are smallblemishes on the surface). FIG. 7 shows a digital image of a plated andpatterned, or struck, coin having a good quality of finish (e.g., thedesign of the pattern is clear, the finish has a shiny finish, and thereare no blemishes on the surface). FIG. 8 shows a digital image of aplated and patterned, or struck, coin having an excellent quality offinish (e.g., the design of the pattern is perfect, the finish has amirror-like finish, and there are no imperfections on the surface).

In Table 3, if a plated article had a Good or Excellent quality offinish, it was designated in the table as Visually Acceptable.

1. Discussion of Results

a. Particle Size Distribution

From an analysis of the results, luminescent particle size can have aninfluence on a number of properties of the resultant plated article.Referring to FIG. 2, the highest luminescent signal measurement fromeach particle size distribution was plotted against signal strength. Inthis Figure, “particle size” on the x axis, and in the discussion below,indicates mean diameter, using SEM analysis. The y axis shows measuredluminescent signal strength (e.g., using an LED and filtered photodiodesignal detector appropriately chosen for the phosphor used in theexperiments). The “Small,” “Medium,” and “Large” size designations inFIG. 2 are further described hereinafter. Note further that the Runnumber designations in FIG. 2 also correspond to the Run Reference Nos.in Tables 2 and 3. The mean particle sizes in FIG. 2 are in microns.

The results indicate that an increase in luminescent signal correspondsto an increase in the amount of particulate material (luminescentparticles) co-deposited into an electroplated layer. Through SEManalysis of a variety of surfaces of the plated examples and the signalresponse of those surfaces, the highest particle populations alsoreturned the largest signals.

b. Sonication of the Plating Solution During the Plating Process

It was found that, at higher luminescent particle sizes(approximately >1 μm), the application of sonication (ultrasoundtreatment) of the plating bath decreased the luminescent signal receivedby the signal detector. This implies that the amount of co-depositedluminescent particles decreases significantly with sonication duringplating. For example, at Large sizes of particles, approximately 1.0-5.0μm, the sonication of the bath during plating decreased the signal toapproximately 120 from an original signal of approximately 165 unitsmagnitude (approximately a 30% decrease).

The approximately 0.5-1.0 μm luminescent particle size range (Mediumsize) behaved in a similar manner to the larger particle sizes undersonication, showing a dramatic decrease to approximately 184 from anoriginal signal of approximately 1262 units magnitude (approximately an85% decrease) in the signal when compared to silent conditions. TheSmall size, approximately 0.2-0.5 μm, particles showed no change inluminescent signal with respect to any change in sonication parameters.

As well as the luminescent signal strength, process considerations, suchas sedimentation and fouling rates, were also altered by sonication ofthe plating solution. These factors are further discussed below.

Sonication of the plating solution was shown to inhibit theco-deposition of agglomerated luminescent particles within the platedmetal matrix. If the colloid is sufficiently de-agglomerated at apre-plating stage (before commencing the plating process), fewagglomerated luminescent particles were co-deposited under sonicated orsilent (i.e., no sonication) plating conditions.

c. Effect of Pre-Plating Sonication of the Plating Solution

For particles in the Small size range of approximately 0.2-0.5 μm,pre-plating sonication (before commencing the plating process) had noeffect on the luminescent signal strength. For the largest particles,approximately 5-10 μm and 10+ μm, pre-plating sonication may have littleeffect on the luminescent signal strength. However, at approximately0.5-1.0 μm, the pre-plating sonication may increase the resultantluminescent signal level from the metal plated layer.

d. Sonication During the Initial Period of Time after Commencing thePlating Process

FIG. 3 shows an image of a cross-section of an exemplary substrate(article) electroplated in accordance with embodiments of the presentinvention.

In FIG. 3, layer C denotes a portion of the substrate of the article,layer B denotes a portion of the initial luminescent-free layer ofelectroplated metal initially laid down during the plating process, andlayer A denotes a portion of the electroplated layer having luminescentparticles dispersed therein.

The extremely low luminescent particle content at theelectroplate-substrate interface (which is inherent to any co-depositionprocess) may be significantly decreased when the ultrasound treatment(sonication) is applied for approximately the first 30 minutes ofplating. This luminescent particle-free layer (layer B in FIG. 3) hasbeen observed to reach up to approximately 2-4 μm in thickness. However,with application of sonication, it can be reduced (e.g., approximately 1μm). The benefit of the application of sonication is a greaterproportion of the plated layer with an ideal particle distribution andalso a cost saving as less plate can be applied whilst still ensuringthe same functional life-time expectations.

e. Physical Effect of Sonication on the Process

Sonication provides energy for dispersing the solid particulates in asuspension throughout the liquid phase (medium) of the plating solution.It was observed during the experiments that the suspension was much moreuniform under sonicated conditions. Without the sonication,sedimentation of some of the solid particulates was observed in all lowenergy areas of the plating baths.

From the results it was observed that, without sonication, a relativelypoor suspension and high rates of sedimentation for all particle sizesgreater than approximately 1 μm was observed. At particle sizes lessthan approximately 1 μm, a reasonable suspension was possible, but thiswas always observed to be enhanced by sonication of the plating bath.

The pre-sonication of the plating bath (i.e., prior to commencingplating) proved to be the most effective. The best suspensions wereformed at all particle sizes when the plating bath was sonicated (e.g.,for approximately 5 hours) prior to plating as well as through theplating process (although this did not necessarily give the best signalstrength in the final plated article).

Sonication performed solely during the plating process (i.e., nopre-plating sonication) did produce a reasonable suspension at particlesizes greater than approximately 1 μm, and a good suspension at particlesizes less than approximately 1 μm.

However, in all cases except the smallest (e.g., approximately 0.2-0.5μm) particles, pre-sonication is more effective. This may be attributedto the fact that, while the plating solution remains un-agitated priorto plating, agglomerates of the luminescent particles are formed, whichrequire more energy to dissociate than can be provided by solelyproviding sonication during the plating process.

The discrepancy at the smallest particle range (e.g., approximately0.2-0.5 μm) has been attributed to an intrinsic property of all smallparticles (agglomerations are thermodynamically favorable as surfacearea and thus free energy are reduced). With the smallest particlestrialed, this effect was exaggerated to the point where, withoutsonication during the trial, larger agglomerates immediately formed.

In all cases, sonication improved the condition of the plating bath(i.e., there was significantly less fouling of the pipework and platingbath and sedimentation with plating processes in which sonication wasperformed). Any sediment that did form during sonicated runs was easilyremoved with a jet of demineralised water. Sediment formed much morerapidly when the plating bath remained silent (no sonication), and thesediment formed a clay-like texture that was extremely difficult tofully remove. Sonication prior and throughout the plating processprovided the best process conditions, but it was observed thepre-plating sonication was a more significant factor in preventingfouling, as most sediment is formed prior to plating while the platingbath is idle. The fouling and sedimentation has a negative effect onheat exchanger, pump, and filter efficiency.

f. Current Density

It was found that for the plating process, a very effective currentdensity lay within the region of 0.3-1.0 A/dm². This takes into accountboth composite formation and matrix plating conditions. The currentdensity used takes into account standard electroplating problems such asthe throwing power (the ability of a plating solution to produce arelatively uniform distribution of metal upon a cathode of irregularshape). For this reason, the current density significantly depends onthe geometry of the plated substrate (article).

g. Turbulence

During the experiments, turbulence in the plating bath was introduced(e.g., mixing using a stirrer and eductor system). The angular velocityof the stirrer, diameter of the stirrer, and the bath geometry affectthe level of turbulence in the bath. It was found that the lower therevolutions per minute (“rpm”) of the stirrer impeller, the higher therate of sedimentation in the plating bath and the lower concentration ofparticulate matter in the bulk liquid phase. This worse suspension ledto lower co-deposition levels and the previously mentioned processproblems related to fouling.

Running the stirrer at a reasonable speed (e.g., less than the speed(critical angular velocity) where vortexes are formed), providedadequate stirring and maximum levels of co-deposition of the luminescentand metal particles in the plated layer. Increasing the stirrer speedbeyond this critical angular velocity did not provide a measurablybetter suspension or increase the levels of co-deposition.

During the electroplating trials where the angular velocity of thestirrer was increased to give extremely high levels of turbulence, itwas observed that—although a good suspension was present—the rates ofco-deposition were low. It is believed that over agitation (e.g.,angular velocity at a speed greater than where vortexes are formed inthe plating bath) of the suspension removes the luminescent particlesfrom the substrate surface being plated during the loose adsorption stepof the co-deposition process. It is believed that this phenomenon wasanalogous to the decrease in levels of co-deposition seen in theelectroplating trials where the plating bath was sonicated duringplating.

Agitation of the plating bath helped to provide a better suspension, butsedimentation still occurred at a lower rate at all the stirrer speedstrialed. Once a sedimentation layer has been formed, the turbulence ofthe plating bath could not provide the energy required to redisperse theparticulate matter. Sonication of the plating bath helps to break up thesediment layer and helps prevent its formation.

Reasonable levels of agitation (e.g., below the critical angularvelocity) combined with sonication provided better process conditions.The sonication de-agglomerates the particles in the plating solution(making their effective particle diameter smaller and thus having alower sedimentation rate) as well as breaking up any sediment. Themechanical agitation combined with the sonication provides the energy todisperse these particles and keep the plating bath in a good colloidalsuspension.

h. Electrochemical Parameters

Different current densities were used during the electroplating trials,ranging from approximately 0.3-1.0 A/dm². The effect of current densityon incorporation of particles was obfuscated by the significant changein throwing power.

The average plate thickness was measured from a random sample of 25articles plated in the experiment. From this data, it was clear that thevolume of co-deposited matter did not significantly alter the platethickness.

The pre- and post-plating masses of the articles were recorded. Thecathode efficiency determined using Faraday's law by comparison to idealplating constants. It was determined that the presence of particulatematter had a negligible effect on the cathode efficiency.

i. Quality of Final Product

With respect to the production of coinage, the quality of the resultantelectroplated finish on a coin that has been struck (i.e., stamped orpatterned with the coin's final design) may be the ultimate determiningfactor for which electroplating parameters achieve a quality of finishon the surface of a struck coin that is acceptable for use in publiccommerce. Note, however, that the following discussion with respect tofinish quality is not limited to the production of coinage, but mayapply to any plated article where the quality of the finish of thesurface is important to utilization of the plated article.

The quality of the surface of a struck coin after being plated inaccordance with embodiments of the present invention was observed to bea function of many of the variables. The luminescent particle size gavea very significant contribution to the plate quality and the resultantfinish. Particles larger than approximately 5 μm seemed to decrease thequality of the surface finish, as can be seen in FIG. 4. In FIG. 4, thewhite arrows are pointing to some of the pitting on the surface of theplated article.

The highest quality plated articles were made with the smallestluminescent particle size (approximately 0.2-0.5 μm). The platedarticles from the particle size range of approximately 0.5-1.0 μm werealso very good.

Any agglomerates present gave a dramatic decrease in the surface qualityof the finished plated article. As the agglomerates are embedded in theelectroplated surface, they can break up causing pits on the surface ofthe finished plated article as shown in FIG. 4. This process may occurdue to the fact that the particle-particle adhesion in agglomerates isvery weak. In contrast, singular luminescent particles incorporated inthe plated layer are held in place mechanically by the grain structureof the plated metal matrix, which makes for a stronger composite productwith a superior surface finish. Therefore, smaller de-agglomeratedparticles are desired from a quality of finish perspective.

2. Conclusions

a. Particle Size

A Medium luminescent particle size distribution of approximately 0.5 to1.0 μm may produce an excellent quality of finish article (e.g., seeFIG. 8) with high luminescent signal output under the correct processconditions. A good quality of finish on plated articles may be obtainedwith particles having a size of approximately 0.2 to 5.0 μm (e.g., seeFIG. 7).

Luminescent particles above approximately 10.0 μm are not easilyincorporated into the electrodeposited layer at the plate thicknessestrialed.

Luminescent particles above approximately 5.0 μm may produce a productwith surface pitting (e.g., see FIG. 4).

The smaller the luminescent particle size, the more readily a goodsuspension is formed of the particles in a plating bath.

The smaller the particle size, the more susceptible the luminescentparticles are to agglomerating.

Luminescent particles in the approximately 0.2-0.5 μm rangespontaneously form agglomerations.

b. Sonication

Optimum sonication conditions were deduced. Excellent results wereobtained when the plating bath was sonicated prior to initiating theplating process (e.g., for approximately 5 hours) and for the firstminutes (e.g., 30) of plating. Other conclusions relating to sonicationare outlined below.

Sonication aids the formation of a homogenous colloidal suspension ofthe particles in the plating bath.

Sonication of the plating bath during the first minutes (e.g., 30-60) ofplating significantly reduces the thickness of the luminescentparticle-free nucleation zone (e.g., layer B in FIG. 3).

Pre-sonication (e.g., for approximately 5 hours) significantly reducesthe fouling of the plating process instruments and sedimentation (e.g.,at the bottom of the plating vessel) that occurs during the platingprocess.

Sonication (e.g., for approximately 5 hours) before plating as well asduring plating can be used to produce good colloidal suspensions fromsystems that, under silent conditions, would not form a stablesuspension.

Sonication during the plating process inhibits the inclusion ofluminescent particles into the metal matrix being plated on the article.

Sonication during the plating process is not as effective aspre-sonication (e.g., approximately 5 hours) at keeping a stablesuspension. This was observed for all particle sizes, except forparticles in the approximately 0.2-0.5 μm range.

c. Turbulence

With respect to agitation (degree of turbulence), very good conditionsfor the process were found to be a stirrer (e.g., overhead type) set toan rpm that stirred the plating bath just below the critical angularvelocity for producing a vortex (which may be combined with arecirculation stream for the low energy areas). Mechanical bathagitation combined with sonication provided excellent processconditions. Other conclusions are summarised below.

The higher the degree of turbulence, the lower the rate of sedimentationin the plating bath, and the higher the concentration of luminescentparticulate matter in the plating solution.

Increasing turbulence increased the degree of co-deposition ofluminescent particles up to a critical point. Beyond the critical point,the degree of co-deposition did not increase, and in fact decreased atextremely high levels of turbulence.

If a layer of sedimentation is formed, turbulence alone cannot returnthe particulate matter into suspension.

Reasonable levels of turbulence combined with sonication provided anexcellent suspension.

d. Electrochemical Parameters

Any change in cathode efficiency caused by the presence of particulatematter within the plating solution was immeasurable and thereforeinsignificant.

Particulate material could be co-deposited from each of the currentdensities trialed.

There was no measurable change in plate thickness between a compositeand pure metal product.

Example 2

The present inventors also have carried out an alternative platingprocess that uses a high shear pump instead of ultrasound. In thisalternative plating process, the plating solution, during plating, wasdiverted from the plating bath, passed through a high shear centrifugalpump, then re-circulated to the plating bath.

The experimental setup of the equipment is the same as for Example 1except the recirculation pump has been replaced by a high shear pump andthe sonotrode is not used. An example of the equipment can be seen inFIG. 12.

FIG. 12 illustrates schematically an apparatus 1200 that may be used forcarrying out the plating process. The apparatus 1200 includes areceptacle 1201 for retaining the plating solution, a tumbler (e.g.rotary) 1202 for tumbling the articles within the plating solutionduring plating process, an electrode 1203 that acts as a cathode duringthe plating process, this electrode extending into the barrel of therotary tumbler, a power source 1204, a further electrode 1205 (e.g., inthe form of a basket), which acts as an anode during the platingprocess, a temperature transmitter (“TT”) device 1206 for temperaturemeasurement (e.g. at pt100 sensor) which is linked via a connector 1208to a temperature controller (“TC”) device 1207, a stirrer 1209, a highshear pump 1210 that circulates plating solution (for example around aconduit 1211 and valve 1212, which maybe a pneumatic valve).

The de-agglomeration chamber can be either set up as a rotor stator oras a simple impeller; the results below are using a rotor stator. Theplating parameters were very similar to those mentioned above for thetechnique that used ultrasound (Example 1), so they will not be furtherdescribed here. In the following, we describe the use of the high shearpump apparatus, and the parameters employed. The high shear inlet pipeis connected directly to the outlet on the side of the tank the returnleg is fed over the side of the tank. The high shear pump was operatedwith a tip speed (circumferential speed of impeller) of 25 m/s and at abath turnover rate of 7.5 bath volume/hr. The high shear pump is usedcontinuously during plating runs to ensure maximum de-agglomeration. Theresults in FIG. 13 show a comparison trial which compares ultrasonicde-agglomeration prior to plating (not during plating as it negativelyaffects incorporation) with high shear de-agglomeration during plating.FIG. 13 shows a comparison of percentage incorporation under high shear(HS) and standard (std) run conditions (i.e. without high shear)

It can be clearly seen in FIG. 13 that the volume percent of the depositoccupied with taggant increased under the high shear treatment. Underthe standard run conditions, the mean volume percentage of incorporationwas determined to be 0.37% vol. While using the high shear setup, themean volume percentage of incorporation was determined to be 1.57% vol.

We claim:
 1. A method for plating articles, the method comprising:providing a plating solution comprising a liquid medium, a precursorspecies suitable for forming a metallic layer on the articles, and aplurality of luminescent particles suspended in the liquid medium, atleast some of which have a diameter of 10 μm or less; and plating thearticles within the plating solution, such that the precursor speciesforms the metallic layer on the articles and the luminescent particlesare deposited within the metallic layer while it is formed.
 2. A methodaccording to claim 1, wherein the luminescent particles have a D50distribution, measured using laser light scattering, in accordance withASTM UOP856-07, of 10 μm or less.
 3. A method according to claim 1,wherein the luminescent particles have a D50 distribution, measuredusing laser light scattering, in accordance with ASTM UOP856-07, of from0.5 μm to 1 gm.
 4. A method according to claim 1, wherein the plating iscarried out while the articles are within a receptacle that movescontinuously during the plating process, and the plating process is anelectroplating process.
 5. (canceled)
 6. A method according to claim 4,wherein receptacle rotates at a constant rate during the entire durationof the plating.
 7. A method according to claim 1, wherein the plating iscarried out while the articles are within a receptacle that is placedwithin the container of plating solution, and the plating solution,before and/or during the plating, is circulated from the container ofplating solution to an agitation unit, in which the plating solution isagitated, and then returned to the container of plating solution.
 8. Amethod according to claim 7, wherein the plating is carried out whilethe receptacle moves continuously during the plating process, and theplating process is an electroplating process.
 9. A method according toclaim 7, wherein the luminescent particles have a D50 distribution,measured using laser light scattering, in accordance with ASTMUOP856-07, of 10 μm or less and the plating is carried out while thereceptacle moves continuously during the plating process, and theplating process is an electroplating process.
 10. A method according toclaim 8, wherein receptacle rotates at a constant rate during the entireduration of the plating.
 11. A method according to claim 7, wherein theagitation unit is or comprises a centrifugal pump.
 12. A methodaccording to claim 7, wherein the agitation involves rotating animpeller within the plating solution in the agitation unit at a tipspeed of from 5 m/s to 50 m/s.
 13. A method according to claim 1,wherein the plating solution is subjected to an ultrasound treatment forat least one of: before the plating of the articles and during theplating of the articles.
 14. A method for plating articles, the methodcomprising: providing a plating solution comprising a liquid medium, aprecursor species suitable for forming a metallic layer on the articles,and a plurality of luminescent particles suspended in the liquid medium;and plating the articles within the plating solution, such that theprecursor species forms the metallic layer on the articles and theluminescent particles are deposited within the metallic layer while itis formed, wherein, before or during the plating of the articles, theplating solution is subjected to an ultrasound treatment, and whereinthe plating is carried out while the articles are within a receptaclethat moves continuously during the plating process.
 15. A methodaccording to claim 14, wherein the plating is carried out while thearticles are within a receptacle that moves continuously during theplating process.
 16. A method according to claim 14, wherein at leastsome of the plurality of the luminescent particles have a diameter of0.5 μm to 1 μm.
 17. A method according to claim 14, wherein the platingsolution is subjected to the ultrasound treatment for a period of atleast 30 minutes before commencing the plating of the articles.
 18. Amethod according to claim 14, wherein the plating solution is subjectedto the ultrasound treatment for a period of at least 1 hour beforecommencing the plating of the articles.
 19. A method according to claim13, when, wherein the plating solution is subjected to the ultrasoundtreatment for a period of at least 3 hours before commencing the platingof the articles.
 20. A method according to claim 13, wherein the platingsolution is subjected to the ultrasound treatment for a period of atleast 15 minutes from commencement of the plating of the articles.
 21. Amethod according to claim 13, wherein the plating solution is subjectedto the ultrasound treatment for a period of from 15 minutes to 1 hourfrom commencement of the plating of the articles.
 22. A method accordingto claim 20 or claim 21, wherein, after the plating solution has beensubjected to the ultrasound treatment during plating of the articles,the plating of the articles continues until a predetermined depth of themetallic layer has been deposited on the articles.
 23. A methodaccording to any one of claims 13 to 22, when dependent directly orindirectly on claim 13 or claims 14, 17 to 22, wherein a frequency ofthe ultrasound treatment applied to the plating solution is at least 10kHz, optionally from 10 kHz to 30 kHz.
 24. A method according to any oneof claims 13 to 22, when dependent directly or indirectly on claim 13 orclaims 14, 17 to 22, wherein a frequency of the ultrasound treatmentapplied to the plating solution is at least 15 kHz, optionally from 15kHz to 25 kHz.
 25. A method according to any one of claims 13 to 24,when dependent directly or indirectly on claim 13 or claims 14, 17 to24, wherein a power of the ultrasound treatment applied to the platingsolution is at least 1000 W.
 26. A method according to any one of claims13 to 14, when dependent directly or indirectly on claim 13 or claims14, 17 to 24, wherein a power of the ultrasound treatment applied to theplating solution is at least 1400 W, optionally or 1400 W to 2000 W. 27.A method according to any one of the preceding claims, wherein thearticles comprise metallic discs.
 28. A method according to any one ofthe preceding claims, further comprising continuously rotating thearticles within the plating solution during the plating of the articles.29. A method according to any one of the preceding claims, furthercomprising stirring the plating solution at an angular speed below theangular speed at which a vortex would be formed within the platingsolution.
 30. A method according to any one of the preceding claims,further comprising stirring the plating solution at an angular speedless than 1800 rpm.
 31. A method according to any one of the precedingclaims, further comprising stirring the plating solution at an angularspeed of from 500 to 1800 rpm.
 32. A method according to any one of thepreceding claims, further comprising applying a potential to effect theplating of the articles, wherein a current density while plating thearticles is from 0.1 A/dm² to 1.5 A/dm².
 33. A method according to anyone of the preceding claims, further comprising applying a potential toeffect the plating of the articles, wherein a current density whileplating the articles is from 0.3 A/dm² to 1 A/dm².
 34. A methodaccording to any one of the preceding claims, wherein the articlescomprise steel, and the metallic layer comprises a metal selected fromzinc, copper, nickel, and alloys of one or more thereof, optionallywherein the metal(s) of the alloys are selected from from zinc, copper,and nickel.
 35. A method according to any one of the preceding claims,wherein the plurality of the luminescent particles comprise a lanthanideand/or an actinide.
 36. A method according to any one of the precedingclaims, wherein the plurality of the luminescent particles comprise anup-converting or down-converting phosphor material.
 37. A methodaccording to any one of the preceding claims, wherein the plating of thearticles is continued until the metallic layer has a depth of at leastapproximately 10 μm.
 38. A method according to any one of the precedingclaims, wherein the plating of the articles is continued until themetallic layer has a depth of from approximately 10 to 30 μm.
 39. Amethod of making a patterned article, wherein the method comprises:providing a plating solution comprising a liquid medium, a precursorspecies suitable for forming a metallic layer on the articles, and aplurality of luminescent particles suspended in the liquid medium;plating the articles within the plating solution, such that theprecursor species forms the metallic layer on the articles and theluminescent particles are deposited within the metallic layer while itis formed, wherein, before or during the plating of the articles, theplating solution is subjected to an ultrasound treatment, and whereinthe plating is carried out while the articles are within a receptaclethat moves continuously during the plating process; and after producingthe plated articles, stamping a pattern into at least one surface of atleast some of the plated articles.
 40. A method according to claim 39,wherein the articles, before being plated, comprise metallic discs. 41.A plating solution comprising: a liquid medium; a precursor speciesconfigured for use in forming a metallic layer during a plating process;and a plurality of luminescent particles suspended in the liquid medium,at least some of which have a diameter of 10 μm or less.
 42. A platingsolution according to claim 41, wherein at least some of the luminescentparticles have a diameter of 5 μm or less.
 43. A plating solutionaccording to claim 41, wherein at least some of the luminescentparticles have a diameter of 0.5 μm to 1 μm.
 44. A plating solutionaccording to claim 41, wherein the precursor species are configured forforming the metallic layer during the plating process, and wherein themetallic layer comprises a metal selected from the group consisting of:zinc, tin, copper, nickel, and alloy combinations thereof.
 45. Anarticle comprising: an electroplated metallic layer disposed thereon thearticle; and luminescent particles homogenously dispersed in theelectroplated metallic layer, in which at least some of the luminescentparticles having a diameter of 10 μm or less.
 46. An article comprising:an electroplated metallic layer disposed thereon the article having afirst portion and a second portion; luminescent particles dispersed inthe electroplated metallic layer in the first portion of theelectroplated metallic layer, and the second portion of theelectroplated metallic layer is disposed between the first portion andthe article, wherein a depth of the second portion is less than 4 μm andis substantially absent of luminescent particles.
 47. The articleaccording to any one of claims 45 to 46, wherein the article is in theform of a disc.
 48. The article according to any one of claims 45 to 37,wherein the article is in the form of a disc having a three-dimensionalpattern stamped thereon after formation of the metallic layer.
 49. Thearticle according to claim 45, wherein the article comprises steel andthe metallic layer comprises a metal selected from the group consistingof: zinc, tin, copper, and nickel, or a combination thereof. 50.(canceled)
 51. (canceled)
 52. An apparatus comprising: a container forholding a plating solution; a receptacle configured to hold a pluralityof articles within the plating solution and further configured to movecontinuously during the plating process; and a means for agitating theplating solution for at least one of before and during a plating processand is configured to perform at least one of: subject the platingsolution to an ultrasound treatment, and circulate the plating solutionfrom the container for holding the plating solution in which thearticles are plated to an agitation unit, in which the means foragitating the plating solution is located in the agitation unit that isseparate from the container for holding the plating solution in whichthe articles are plated, in which the plating solution is agitated forat least one of before and during plating of the articles, and thenreturn the plating solution to the container for holding the platingsolution in which the articles are plated.
 53. The apparatus accordingto claim 52, wherein the means for agitating the plating solution in theagitation unit comprises an impeller.
 54. The apparatus according toclaim 52, wherein the means for agitating the plating solution in theagitation unit comprises a centrifugal pump.